Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2025-10-06 10:18:05.0
KOKI, a global leader in advanced soldering materials, is pleased to announce its participation in SMTA International 2025, taking place October 21–23, 2025, at the Donald E. Stephens Convention Center in Rosemont, Illinois. Visitors can connect with the KOKI team at Booth #3030.
Industry News | 2022-11-15 12:50:53.0
Nihon Superior Co. Ltd. is pleased to introduce its LF-C2 Lead-Free Solder Paste. Designed for automotive applications, LF-C2 is the high-strength alloy of choice when cracking minimization is a key selection criterion.
Industry News | 2010-09-02 10:54:09.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that the research it sponsored at the University of Queensland, Australia provided the basis for the paper that earned an ICEP Outstanding Paper Award.
Industry News | 2025-09-03 20:56:31.0
KOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce an upcoming webinar: Enhancing Solder Joint Reliability Through Advanced Materials Development. The event will take place on Thursday, September 11, 2025, at 12:00 PM CDT.
Industry News | 2012-02-07 16:20:22.0
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present the paper titled “Effect of Cooling Rate on the Intermetallic Layer in Solder Joints” at the upcoming IPC APEX Expo.
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Industry News | 2011-12-30 23:35:59.0
Nihon Superior will issue a new series of guides on “Key Factors in the Selection of Lead-Free Solders.” This series is intended to address the challenges in choosing a reliable lead-free solder. The first guide in the series is titled “Reliability of Lead-Free Solder in Thermal Cycling.”
Industry News | 2014-11-18 18:10:25.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.
Industry News | 2009-09-17 15:00:44.0
OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that research sponsored by the company was recognized by the University of Queensland as one of the best examples of a successful cooperation between the university and the industry.
