Industry News | 2011-12-30 23:20:54.0
SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces that it will host a workshop titled Handling Moisture-Sensitive Components & PCBs Without Failure on Wednesday, January 25, 2012 at the Stoke Mandeville Stadium in Aylesbury, Buckinghamshire, UK.
Industry News | 2009-04-09 20:18:51.0
ECD is proud to announce the release of the newest resource for it's customers. ECD Thermosphere will be covering topics from thermocouple attachment to "Wavy Profiles"
Industry News | 2017-08-29 08:23:24.0
Seika Machinery announces that Michelle Ogihara, Senior Sales Manager at Seika, will co-chair the MSD Council Meeting with Mumtaz Bora, Peregrine Semiconductor, at SMTA International. The meeting is scheduled to take place Tuesday, September 19, 2017 at 2 p.m. in the Boardroom, Upper Level, South Ballroom of the Donald E. Stephens Convention Center, Rosemont, IL.
Industry News | 2019-05-16 01:24:13.0
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.
Industry News | 2018-09-23 09:54:24.0
The industry’s leading manufacturer of critical cleaning, coating and lubrication products, MicroCare Corp. has extended its portfolio even further with the launch of new and progressive products which will be showcased at this year’s SMTA International in Chicago, Illinois, USA from 14 – 18th October, which includes a new series of flux remover pens.
Industry News | 2011-10-07 23:12:37.0
Seika Machinery announces that Michelle Ogihara, Senior Sales Director, will co-chair the Moisture Sensitive Device (MSD) Council meeting during the upcoming SMTA International Conference & Exhibition
Industry News | 2011-12-12 19:11:19.0
Seika Machinery announces its year-end special on high-quality, reasonably-priced products.
Industry News | 2012-01-05 19:20:11.0
Multitest announces that its UltraFlat™ process meets the requirements of high parallel vertical probe card applications.
Industry News | 2012-05-31 14:49:02.0
Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.
