Industry News: corner damage (Page 1 of 2)

How to Prevent Short Circuits to Ground in QFN Components?

Industry News | 2018-10-18 08:29:16.0

How to Prevent Short Circuits to Ground in QFN Components?

Flason Electronic Co.,limited

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

Bliss Industries Introduces New Green Packaging Method

Industry News | 2009-05-29 10:22:51.0

MILPITAS, Calif. � May 2009 � Bliss Industries Inc., provider of handling carts and racks for electronics assembly, announces a new Green packaging method to be implemented on all future cart shipments.

Bliss Industries, Inc.

ACL Staticide Introduces Conductive Trays

Industry News | 2021-07-23 14:55:55.0

ACL Staticide introduces Conductive Trays to their static control product line. ACL Staticide Conductive Trays provide ESD protection for static sensitive electronic components during handling and transportation. Stackable and durable, ACL's Conductive Trays have excellent abrasion resistance and can withstand chemical damage. Made from fiberglass polypropylene with conductive additives, these trays will not outgas or lose electrical properties even after washing.

ACL Staticide, Inc.

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill

Industry News | 2011-04-07 20:23:54.0

Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.

Zymet, Inc

Metcal to Show Connection Validation System at SMTA Atlanta Expo

Industry News | 2019-04-04 18:55:12.0

Metcal today announced plans to exhibit at the SMTA Atlanta Expo, scheduled to take place Thursday, April 11, 2019 at the Atlanta Technology Park in Peachtree Corners, GA. Metcal will demonstrate its Connection Validation (CV) Soldering System with new hand-pieces, MFR-1350 Desoldering System, HCT2-200-11 Hot Air Pencil and AC-STC Tip Cleaner.

Metcal

VJ Electronix Presents New Component Auto Align Option

Industry News | 2022-09-08 06:59:42.0

VJ Electronix, Inc. is pleased to introduce the new Component Auto Align option for its Summit 2200i rework system. The system can now be upgraded via software or purchased new with the option for Component Auto Align.

VJ Electronix

COUNTER SINK VS COUNTERBORE

Industry News | 2019-05-16 01:22:31.0

Many Cusromers inquiry Headpcb's capabilty of counter sink board, and they are easy to mismatch counter sink with counterbore. In fact, there have big difference between counter sink and counterbore, today Headpcb's senior RD engineer Macros Zhang spare an article about counter sink and counterbore, hope this will help you having a better understanding about them.

Headpcb

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