Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2003-04-30 08:37:19.0
Altium to preview industry-first technology at Programmable World that allows engineers to use board-level methodologies to design and implement embedded systems on FPGAs
Industry News | 2012-06-01 13:55:57.0
As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges
Industry News | 2015-12-05 16:08:55.0
During the 2015 Annual Meeting at SMTA International, the SMTA announced that Hanju Oh, a graduate student at Georgia Institute of Technology, has been selected as the recipient of the 2015 Charles Hutchins Educational Grant. The SMTA Grant Committee selected his project entitled "A Three-Dimensional Packaging Platform with Integrated Microfluidic Cooling."
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2012-08-03 08:30:27.0
Omron Inspection Systems (www.omron247.com) will display and demo its latest concepts and enhancements in AOI systems at the 2012 IPC Midwest Conference & Exhibition
Industry News | 2008-02-22 16:25:50.0
The SMTA is pleased to announce its spring packaging symposium. The 3D/SiP Advanced Packaging Symposium will be held April 28-30 at the Washington Duke Inn & Golf Club in Research Triangle Park, NC.
Industry News | 2010-08-17 14:08:36.0
The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.
