Industry News | 2023-07-10 18:25:44.0
ZESTRON is excited to announce an upcoming webinar titled, "Enhancing Yield and Reliability of Ultra-Fine Pitch Die through Defluxing on CoWs" on July 20th, 2023, at 2:00 PM EST.
Industry News | 2011-10-12 21:39:45.0
Multitest announces that the Santa Clara board fab has refined its pulse plating process to integrate it into Multitest’s fabrication process to further enhance the high aspect ratio capability.
Industry News | 2013-10-02 22:57:57.0
Transition Automation announces a further refinement of the PrinTEK line of benchtop SMT printers. The enhancement gives users greater control of the Z-height adjustment that is critical for achieving high quality fine pitch printing.
Industry News | 2009-12-14 20:45:09.0
December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).
Industry News | 2016-12-26 13:40:59.0
SMT Step Stencils provide increased control over your print process. Vary thickness in any area of your stencil to generate the exact paste volume and height for every single component. A perfect solution for Pin-in-Paste applications. For FREE Technical Assistance please call (760) 798-6984
Industry News | 2022-01-29 13:28:14.0
Indium Corporation has expanded its manufacturing capabilities to include a fine diameter 0.004" (0.10mm) flux-cored wire made with select Pb-free alloys to help customers meet the progressively demanding requirements of fine-pitch applications.
Industry News | 2022-12-26 11:34:19.0
ZESTRON is pleased to announce that ZESTRON's Senior Application Engineer, Ravi Parthasarathy will be presenting, "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs", at IPC APEX 2023 taking place in San Diego, California.
Industry News | 2017-02-09 08:35:06.0
FARNBOROUGH, UK ― February 2017 ― Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that its Chief Technology Officer Dr Chris Hunt will present the paper titled “SIR intercomparison to validate the use of fine pitch pattern” at the upcoming IPC APEX EXPO. The presentation will be held during the session titled “SIR/Flux Reliability” on Tuesday the 14th February between 15:30 – 17:00pm in location 4.
Industry News | 2001-02-16 10:32:40.0
Juki Automation Systems has introduced the KE-2020, a high-speed flexible assembler designed to place small and odd shaped components, as well as standard components, at optimum speed. The KE-2020 is equipped with a high-speed four-nozzle head for placing components and has one fine-pitch placement head with one nozzle capable of placing 0201 components, micro BGAs, CSPs and other odd-shaped components.
Industry News | 2021-07-26 17:33:25.0
High thermal mass and fine-pitch components place increased demand on the selective soldering process. This tech paper outlines techniques that minizine these demands.
