Industry News: gold embrittlement purple (Page 1 of 1)

FREE Download of Failures Analysis Booklet from ACI Technologies

Industry News | 2016-11-30 14:47:45.0

ACI Technologies invites you to download a free copy of its very popular e-booklet, “Failure Analysis Techniques for Electronics” from its Website store, which is located at http://store.aciusa.org/Failure-Analysis-Techniques-for-Electronics-Digital-Download-P181.aspx

ACI Technologies, Inc.

Hentec Industries/RPS Publishes an Engineer's Guide to Component Re-Conditioning Process

Industry News | 2021-04-13 17:37:07.0

Gold plating dissolves rapidly during soldering and can result in gold embrittlement. This tech paper examines how to re-condition electronic components prior to soldering.

Hentec Industries, Inc. (RPS Automation)

Hentec Industries/RPS Publishes Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components

Industry News | 2021-07-26 17:33:25.0

High thermal mass and fine-pitch components place increased demand on the selective soldering process. This tech paper outlines techniques that minizine these demands.

Hentec Industries, Inc. (RPS Automation)

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