Industry News: hyperlynx thermal (Page 1 of 1)

Mentor Graphics Announces PADS PCB Product Creation Platform with Voltage Drop and Electronic Cooling Capabilities

Industry News | 2016-05-05 20:33:25.0

Mentor Graphics Corporation (NASDAQ: MENT) today announced a comprehensive product-creation platform based on PADS® PCB software that enables individual engineers and small teams to solve the engineering challenges involved in creating today’s electronic products. With increasing systems design complexity and the need for printed circuit board (PCB), mechanical and systems engineers to access easy-to-deploy tools, the PADS platform has been extended to enable engineers to develop PCB-based systems from concept through manufacturing hand-off.

Mentor Graphics

TSMC Collaborates With Mentor Graphics, Enabling Design and Verification Tools for New InFO Technology Variants

Industry News | 2017-01-11 17:14:16.0

Mentor Graphics today announced that TSMC has extended its collaboration with Mentor Graphics on the Xpedition® Enterprise platform in conjunction with the Calibre® platform for the design and verification of TSMC’s InFO (Integrated Fan-Out) packaging technology for multi-chip and chip-DRAM integration applications. Mentor developed new Xpedition functionality specifically to support InFO and enable the IC package designer to complete design tasks to TSMC specification. By leveraging the capabilities of both the Calibre and HyperLynx® technologies, the new Xpedition functionality minimizes the designer effort and design rule checking (DRC) cycles required to achieve a DRC-clean InFO GDS file.

Mentor Graphics

Mentor Graphics Launches Xpedition Package Integrator Flow for IC-Package-Board Design

Industry News | 2015-03-23 12:27:07.0

Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization. The Package Integrator solution automates planning, assembly and optimization of today’s complex multi-die packages. It incorporates a unique virtual die model concept for true IC-to-package co-optimization. In support of early marketing-level studies for a proposed new device, users can now plan, assemble and optimize complex systems with minimal source data. The new Package Integrator flow allows design teams to realize faster and more efficient physical path finding and seamless tool integration for rapid prototyping, right to the production flow.

Mentor Graphics

Mentor Graphics Announces Next-Generation PADS Flow with Chinese Language Support, Interactive Routing, and Usability Enhancements

Industry News | 2012-11-05 19:42:49.0

Mentor Graphics announced the availability of the next-generation PADS® flow with the introduction of PADS 9.5. This release adds usability enhancements, GUI improvements in DxDesigner®, interactive routing updates, and availability in Simplified Chinese language. The scalable PADS 9.5 flow enables users to cost-effectively design their products, from standard PCBs to the industry’s most complex, highest performance, and densest PCBs.

Mentor Graphics

Mentor Graphics Launches Xpedition Path Finder Suite for Efficient IC/Package/PCB Design Optimization

Industry News | 2014-06-12 11:12:47.0

Mentor Graphics Launches Xpedition Path Finder Suite for Efficient IC/Package/PCB Design Optimization, Assembly, and Visualization

Mentor Graphics

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