Industry News | 2009-05-26 18:16:29.0
In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
Industry News | 2011-10-13 04:38:26.0
How are drilling and routing machines and equipment manufacturing companies performing? What strategies do they employ? What is the value of dual spindle technology and is it a global trend? To answer the third question, first you'll have to keep on reading about this fascinating technology which is becoming more and more important in the US, as well as in Asia.
Industry News | 2024-08-07 09:30:35.0
EVS International, the leader in solder recovery, is excited to announce that it will be exhibiting the EVS 500LF at two upcoming SMTA Expos. Attendees will have the opportunity to experience firsthand the innovative features and benefits of the EVS 500LF at the SMTA Michigan and SMTA Ohio Valley Expo & Tech Forums.
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