Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2018-10-18 10:49:25.0
Panelizing PCBs with Tab Routing
Industry News | 2012-03-28 08:47:23.0
he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-10-18 11:15:12.0
PCB Design and Layout Guidelines
Industry News | 2018-02-22 06:49:37.0
Plastic Optical Fiber Gains Ground for Gigabit Ethernet Connectivity in Vehicles
