Industry News | 2018-10-18 08:46:25.0
"Lead-Free" Semiconductor Industry
Industry News | 2019-01-30 08:13:02.0
The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.
Industry News | 2020-03-19 13:12:42.0
The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Industry News | 2015-09-03 16:37:18.0
SMTA China announces that it presented awards for seven papers at the SMTA China South 2015 Conference Award Presentation Ceremony, held on Tuesday, August 25, 2015 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Industry News | 2021-08-26 11:15:20.0
MacDermid Alpha Electronics Solutions announces the release of MICROFAB EVF NiBAR, a boric acid free sulfamate nickel electroplating process for semiconductor applications.
Industry News | 2015-11-10 18:02:56.0
Numerical Cloud is a new offering from Numerical Innovations allowing users the option to get all of their NI products online (on the “Cloud”) for a simple monthly subscription. Sign Up Now: http://bit.ly/29GXjT2
Industry News | 2011-01-18 12:16:31.0
Nihon Superior Co. Ltd. announces that company President Tetsuro Nishimura will present a paper titled “Recent Developments in the Application of Sn-Cu-Ni+Ge Lead-free Solder and Halogen-free Fluxes” at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Industry News | 2014-01-07 18:34:43.0
Nihon Superior Co. Ltd. announced that it will exhibit in EAST 3-27 at the upcoming INTERNEPCON 2014, scheduled to take place January 15-17, 2014 at the TOKYO BIG SITE in Tokyo, Japan.
Industry News | 2008-03-05 22:38:31.0
OSAKA, JAPAN � March 5, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper, titled �High Impact Strength Tin-Copper Based Lead-free Solder Bump Alloys� authored by Tetsuro Nishimura, Shoichi Suenaga and Keith Sweatman, to the Technical Conference that is part of the TMS 2008 Annual Meeting and Exposition scheduled to take place March 9-13, 2008, in New Orleans, Louisiana.
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