Industry News | 2013-07-19 11:33:18.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2013-07-17 19:05:42.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2014-01-17 12:52:25.0
BEST Inc., has developed a line of Kapton™ SMT stencils for the prototype assembly market. These stencils, available in 4,5 and 6 thicknesses, present very flat coplanar printing surfaces for solder paste printing. . They are designed to be used when the there are very few boards to be made at one time and the pitch of the components is 1.00 and above.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2009-03-02 00:28:54.0
DEK has announced the launch of its VectorGuard� Platinum stencil technology. Now available for DEK customers in Asia, Europe and the Americas, the new technology provides semiconductor manufacturers with an ideal solution for a diverse range of next-generation challenges.
Industry News | 2011-02-26 14:35:16.0
Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.
Industry News | 2012-08-20 13:00:35.0
Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.
Industry News | 2012-08-20 13:01:17.0
Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.
Industry News | 2013-02-21 07:08:43.0
Multitest, announces that it has been awarded a 2013 NPI Award from Circuits Assembly magazine in the category of Test & Inspection – Functional Test for its InStrip 3D.
