General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Precise lines are dispensed to fill an area on a heat sink. At the end of this video, you can see a demo of placing a glass slide on top of the dispensed material to see uniformity of the area. http://www.nordsonasymtek.com
Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system. This leaves consistent print
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
