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General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

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Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

4 Vreeland Rd.
Florham Park, NJ USA

Phone: 973-377-6800

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications

Selective Soldering Nozzles

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Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...

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2024 Eptac IPC Certification Training Schedule

The 2024 IPC Certifications Schedule is Here. Train In-Person, Online or On-Site. EPTAC is the Leader in Electronics Manufacturing Training with 24 Locations across North America.

PCB Depanelizers

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