Electronics Forum | Thu Nov 01 13:02:13 EDT 2007 | slthomas
What are you using? I'm having a tough time finding something I used to use (Kester, seems like it had a liquidus temp. of about 265�).
Electronics Forum | Fri Nov 02 11:34:44 EDT 2007 | jdumont
I also use a very high lead content solder for this. Its awful to solder with but works quite well once you have it on...
Electronics Forum | Fri Nov 02 10:57:11 EDT 2007 | 85638
7500 mm3 in combination with very small devices like 0402 in the same assembly ?. I am facing profiling problems due to this extreme mix. Thanks in advance for your valuable inputs.
Electronics Forum | Tue Nov 06 09:10:02 EST 2007 | ralphspm
What would be the best software packages available to produce assembly programs from basic gerber data?I'm using FUJI CP3 & IP1 M/C's with fujiflexa software.
Electronics Forum | Thu Nov 08 10:02:55 EST 2007 | hussman
Yes. I used to use em on our old 286. The side clamps work very well with them and our missing parts from support pin problem went away. It was our #1 defect a few years ago. 100%ing work orders for missing parts sucks.
Electronics Forum | Tue Nov 20 23:20:02 EST 2007 | er_pe
Please take a look at the write ups here on this forum regarding the ACE KISS systems. Have you taken a look at and reviewed the Pillarhouse systems ???
Electronics Forum | Tue Nov 27 18:31:02 EST 2007 | devgru
I would agree with the above. Epoxy is the way to go. You can have it formulated in different thicknesses and cure times, but you need to watch out for the exothermic heat from the curing.
Electronics Forum | Sun Dec 02 22:00:21 EST 2007 | shy
The idea for solder at bottom side is for component such as SOIC, QFP and chip. This solder is needed since not entire bottom component had glue. that's why we're combining both solder paste and glue and reflow at the same time.
Electronics Forum | Sun Dec 02 22:03:14 EST 2007 | shy
Hi Habsfan, if we're mount the THP first, we can't run SMT due to tTHP is tall and big which will causing the PNP to be chaos. Btw, my solder paste location is more than glue location which (solder paste : glue) is 2:1.
Electronics Forum | Sun Dec 02 22:52:36 EST 2007 | shy
Hi Dback, Kindly provide your e-mail then i'll give the current opening pracitce at my area.
