Electronics Forum: /08 (Page 1486 of 1615)

Re: Component solderability problems TO263 package

Electronics Forum | Wed Aug 09 22:00:44 EDT 2000 | Dave F

Hey Charles!!! Where in earthly heaven did you get a TO263 with "large solderable tab (approx 8mm square) on the back and 5 leads"? All the TO263s that�ve reached-up and smacked me have been "TO220s" with a modified tab and three leads that are f

Re: Component solderability problems TO263 package

Electronics Forum | Thu Aug 10 12:14:12 EDT 2000 | Charles

It looks like a giant dpak device but with 5 leads. The problem is that on approx 3% of our boards one more pins are open circuit. It appears that the pins are not in contact with the pads. Board is HASL finish IR oven Paste Koki 953i. If you have a

Re: Clamshell printers

Electronics Forum | Thu Aug 03 19:49:16 EDT 2000 | Darby

I presume you have no vision alignment. Buy yourself a little monocular measuring microscope ( about $100 ). You are not going to get the registration you require between stencil and pcb for each print if you are running off tooling pins , edge clamp

Re: Clamshell printers

Electronics Forum | Fri Aug 04 12:57:34 EDT 2000 | Steve Thomas

James, we used to use 3 clamshell type printers (one of which did have a two camera vision system, and did all our fine pitch), but had limited success with 20 mil pitch. 25 mil pitch was no problem. I suspect that you'll find people that have had

Re: Clamshell printers

Electronics Forum | Mon Aug 07 18:20:40 EDT 2000 | Darby

James, I only use the clamshells for fine pitch if my other printers are non operational. Not reccommended but achievable in an emergency. In answer to your questions. We use two clam shell printers and two vertical lift printers. All are used for 8

Re: IC leg of RF unit lifted..

Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F

Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan

Re: soldering books

Electronics Forum | Sat May 06 08:42:18 EDT 2000 | Dave F

Hi Steve: Easy question, Klein Wassink is THE BOOK. It is head and shoulders above the others. Coombs: Very good book, focused primarily on board fab with some discussion on assembly. Lea: A dated, once very good book. Rahn: Average book. Actu

Re: WAVE SOLDERING 0603 CHIP RESISTOR ARRAYS

Electronics Forum | Wed Apr 12 20:41:31 EDT 2000 | Dave F

Russ: That�s a pretty stand-up postin� bud. It�s neat that you can root-out that dirt. We couldn�t dig-up that stuff, if they threatened to shoot the dog. You could be correct about using convex for waving. We don�t wave RNET as Philips suggests

Re: Hot Air Knife

Electronics Forum | Wed Mar 08 17:01:32 EST 2000 | Russ

So far, I have not been able to get any consistant or good results using one of these "problem solvers". I have managed however, to screw up some good processes. I believe that this technology can work though. I would reccomend contacting Speedlin

solder balls

Electronics Forum | Thu Feb 08 09:07:22 EST 2001 | Hussman

OK, without knowing the specifics, why does everyone blame the oven? Most solder balls occur around R's and C's in almost every shop I've been to. The best place to start looking is the screen printer - not the oven. Sure the oven is the last proc


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