Electronics Forum | Tue Mar 17 16:09:25 EDT 2009 | gregf912
For the IP3 to reliably place BGAs the machine needs the 4800 vision card and type 12 camera. From the problems i see here you must have the 4400 card and a type 8 or 9 camera. It would also seem that a calibration is in order. I have calibrated and
Electronics Forum | Wed Mar 18 15:16:09 EDT 2009 | wayne123
I was told I needed to figure out what kind of fire extinguisher we needed for our Smt line. this includes 2 topaz pick n places, and a reflow oven. I also have to figure out what kind of extiguisher to use at our Wave machine. can anyone tell me w
Electronics Forum | Fri Mar 27 09:37:15 EDT 2009 | cyber_wolf
There are pem nuts on the back side of the teddy bear face. One of them probably fell off and either shorted your main board or it is lodged in the belt and pulley that drives the advancing wheels. Take the front part of the feeder off that has the t
Electronics Forum | Tue Apr 14 09:45:31 EDT 2009 | meritajs
Hello, Peter I suppose you could find Philips feeders here http://www.equipmatching.com/used_equipment/2/5/77099.php At this site you can put your ads about wanted equipment. We bought here many used Equipment for exelent price Best regards Peter
Electronics Forum | Fri Apr 17 09:39:07 EDT 2009 | rkevin
I received my sample jar of NC257-2 SAC305 from Aim, and while that may have been true about older Aim paste formulations, this stuff prints and reflows better than anything I have tried and more importantly there were practically no voids on a 256 B
Electronics Forum | Thu Apr 09 06:22:27 EDT 2009 | qualityguy
We aware of the extend time for cure, and in the CA activity we tried plasma etch and expose the sample to the current process, a screen test of 4 cycles -50C to 125C and the CC held in place. Std IPC tape test passed in current process and modifie
Electronics Forum | Thu Apr 09 21:15:43 EDT 2009 | qualityguy
Interesting, A north American Solder resist firm stated the same thing to a degree. They said altering the resist cure profile can effectively change the surface energy thus making the surface more conducive to conformal coat adhesion. At in coming
Electronics Forum | Thu Apr 09 12:27:12 EDT 2009 | devgru
Hi Dominic, By any chance did you look at yestech? I have a couple of their systems and have one dedicated for SPI. A while back, I did look at the CyberOptics SPI system, and while a very good system, I couldn't get the ROI into a range that was goo
Electronics Forum | Thu Apr 09 13:38:41 EDT 2009 | thenrz
I'm working with a GSM machine and have a question - How do I go about using a local fid to act as a bad mark? Is that even the way to go about it? I have a stack of board here with one or more badmarks and it is a waste of time to keep modifying
Electronics Forum | Thu Apr 16 09:54:12 EDT 2009 | davef
We know virtually nothing about your process, but here's some guesses: * Turn-off the nitrogen * Change from Sn63 to Sn62 * Change to a low-tombstone paste * Change the thermal recipe: slower ramp, longer soak * Do a better job of placing components
