Electronics Forum | Fri Apr 15 14:25:57 EDT 2011 | ryanr
We've received in a batch of ICs (Xilinx FPGAs) from a customer on consignment that are having wetting issues. I believe the chips are contaminated. We also know that the chips were bought from a broker. Is there a method to remove the contamination
Electronics Forum | Fri Jun 03 05:38:54 EDT 2011 | grahamcooper22
Ideally the MSL should be recorded on the label on the DRY PACK that you receive the devices in....that's the protocol the device manufacturers / distributors should use to help your goods in and shop floor personnel know which are/are not moisture
Electronics Forum | Tue Jul 17 00:10:32 EDT 2012 | amitsindwani
Referring to IPC/JEDEC J-STD-033B.1 section 3.3.2.2 'The amount of desiccant used, per moisture barrier bag, shall be based on the bag surface area and WVTR in order to limit the interior relative humidity in the MBB to less than 10% at 25°C.' So wha
Electronics Forum | Wed Sep 23 14:30:05 EDT 2015 | deanm
"...air evacuation is not required (Figure 3-5). Light air evacuation may be used to reduce the packaging bulk and enhance carton packing (Figure 3-6). Full evacuation shall not be used as it will impede desiccant and HIC performance and possibly lea
Electronics Forum | Tue Jan 21 16:11:05 EST 2020 | dgiordano
3.3.5.1 HIC Placement states "The HIC may be placed anywhere in the MBB, but should not be placed under, on top or touching a desiccant pouch." How do you assure that the HIC doesn't touch the desiccant pouch? Do you secure the HIC to the reel or to
Electronics Forum | Wed Feb 08 11:46:19 EST 2023 | tommy_magyar
Yes, your statement is correct. J-STD-033B.1 section 5.3.3.2 SMD packages not sealed in a MBB may be placed in a dry atmosphere cabinet, maintained at not greater than 5% RH. Storage in these dry cabinets may be considered equivalent to storage in a
Electronics Forum | Fri Feb 10 05:34:55 EST 2023 | ysundar71
Thanks for the comments. As per D Revision of J STD033, clause 5.3.3.2: Dry cabinet at 5% RH SMD packages not sealed in a MBB may be placed in a dry atmosphere cabinet, maintained at not greater than 5% RH. Storage in these dry cabinets may be consid
Electronics Forum | Wed May 15 13:11:26 EDT 2002 | fmonette
Hi Dason, Yes I was talking about the same paper. This is the best technical information available to clearly explain the physics of moisture diffusion inside a plastic package. Many of the guidelines contained in the current J-STD-033 are derived
Electronics Forum | Thu May 06 08:29:41 EDT 2004 | Christopher Lampron
10% RH) Do these stored components need baking before I use them now or not? * Depends on the MSD level (should be marked on packaging) Level 6 component need to be baked prior to asembly no matter what. Other levels should be OK if they were store
Electronics Forum | Mon Nov 27 12:17:02 EST 2000 | Dason C
Chris, you are not completely right. Our industrial is following the IPC standard as our guideline. Per IPC J-STD-033 has specify the floor life at para. 8 (normal condition at 30C/60%RH). If Victor can control his environment at 32% then the compo
