Electronics Forum: 2

Black pad on BGA after removal

Electronics Forum | Thu May 05 16:18:47 EDT 2005 | jimmiem

The black pads that we see are on the BGA component. We removed the component from its site and on 2-3 pads 100% of the ball stuck to the pad on the PCB and the corresponding BGA pad was black.

Boards getting

Electronics Forum | Wed Aug 03 14:17:28 EDT 2005 | GS

What about PCB construction?: - CEM (2-3....)? FR4 ?....? - how many layers - what about TG ? GS

CP6 Maintenance

Electronics Forum | Fri Apr 21 03:20:04 EDT 2006 | kent_peterson

I think your refering to the sleeve. It is held in with loctite 262 or something. You can set up a bearing puller with a socket to pull it out around station 2-3. Fuji will drop the whole gear out to do this. Too much for a few sleeves.

Peel back force

Electronics Forum | Thu Aug 31 16:06:26 EDT 2006 | GS

I rember time ago, the EIA-481 (1-2-3) and recntly may be EIA-200 ? sorry I anm not sure. Best Regards.........GS

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Thu Oct 05 16:06:33 EDT 2006 | cw

Thanks! What's your ramp rate?2 - 3C/sec? What's your time above 217C. What's your peak temp?

Reflow Problems

Electronics Forum | Fri Jan 19 02:03:09 EST 2007 | lococost

As a sidenote, if nothing of the above works, IPC 610 states that it is accetable (class 1,2,3) for solder to touch a SOT body if it is plastic.

Tape and Reel - IPC/JEDEC or other Standards ?

Electronics Forum | Tue Jan 23 17:48:17 EST 2007 | GS

for SMDs, try to look for EIA-481.1.2.3, or may be the new version EIA-200 if I am not wrong. Also IEC 60286-2 (leaded components like axials, radials,..) Regards......GS

ImSn thickness

Electronics Forum | Fri Feb 16 08:28:50 EST 2007 | pavel_murtishev

Good afternoon, Typical plating thickness for immersion tin is 0.6-1.0um. I do not know what the maximal thickness is. But plating is self-limiting process and I believe maximal thickness should be about 2-3um. BR, Pavel

SMT adhesive suggestions?

Electronics Forum | Thu Jul 26 08:39:16 EDT 2007 | d0min0

since 1999 we use Heraeus PD944, in time we tested Loctite also but had some issues with it - or with our machine specialist :)) we dispense with Fuji CP (2 , 3 & 4) it only creates problems when its on the solder pads ;-) best wishes

BGA Baking in Reels?

Electronics Forum | Wed Feb 06 17:28:27 EST 2008 | blnorman

We have some components on a reel that are 2.3 mm in thickness and need to be baked out. The reel has a warning not to exceed 50�C. According to J-STD-33, the proper bake out is 67 days @ 40�C.


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