Electronics Forum: 2.. (Page 471 of 1147)

Reduced component lead diameters

Electronics Forum | Wed May 03 10:58:35 EDT 2006 | rlackey

Hi has anyone noticed any issues with reduced component lead diameters on through hole resistors? All the volume manufacturers have or are in the process of reducing the lead diameters from 0.6mm to 0.4mm due to the huge increase in copper prices o

Capacitor Shorts after Depaneling

Electronics Forum | Wed May 10 13:21:58 EDT 2006 | scombs

Thanks for the reply. We have carefully inspected the part and solder joint after depaneling and all looks good. What is weird is if you remove the part from the board and check continuity with a meter you have a dead short. If you put on a new part

Cartesian robot

Electronics Forum | Mon May 15 01:21:44 EDT 2006 | eeltec

Help: I have a cartesina robot brand Shibaura Engineering Works Co Ltd (now Toshiba) model AMI-A2R40A. I do not have any manuals so I do not have a programming reference manual. I will thanks any information; a user manual or a lenguage short list or

MyData Placement Accuracy

Electronics Forum | Thu May 18 03:47:20 EDT 2006 | Scott

We have 2 Mydata machines. Accuracy is closer to 25microns at 3 sigma and you'll be lucky to get a quarter of the 20K placement rate. Their flexibility is their selling point and are prefectly suited for high mix - low/med volume. I wish your high vo

Palladium poor wetting

Electronics Forum | Wed May 24 16:57:23 EDT 2006 | Steve

The temperatures were measured on the board, ~1/2" away from the components in question. Admittedly the profile is on the bottom end of the Alpha recommendations. The profile was set up this way intentionally to avoid heat damage to other components

LQFP128 doesn't work when cold

Electronics Forum | Wed May 31 16:09:14 EDT 2006 | barryg

Did You verify operation of the oscillaators(resonaters) by heating and cooling and looking at the waveforms and frequencies when doing so. We have problems when they are not packed correcttly from vendors , and sometimes they can get crackes in them

Solder paste volume require.

Electronics Forum | Thu Jun 01 08:39:36 EDT 2006 | russ

IPC a 610 has this info. An 0402 however mat require more solder than what IPC states (basically evidence of wetted fillet for class2). more paste = more flux = better wetting. Why don't you tell us what pad sizes and layout you have and stencil t

Assembl�on feeders

Electronics Forum | Wed Jun 14 09:22:36 EDT 2006 | pavel_murtishev

Good afternoon, 1. Use only melf nozzles (Type 76) 2. In case if your melfs are picked up one after another try to increase feed time in machine setup, this will add additional delay and will allow feeder to complete feed cycle 3. Use the strongest

Black PAD

Electronics Forum | Wed Jun 14 20:49:32 EDT 2006 | davef

We too do not use ENIG. Too expensive and risky. Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating ; BabHui Lee; Circuitree 11/1/03 http://www.circuitree.com/CDA/Archives/34f2b

BGA Reballing

Electronics Forum | Tue Jun 13 23:08:32 EDT 2006 | mrduckmann2000

WINSLOW IS NOT THE BEST CHOICE, WE HAVE TRIED SEVERAL DIFFERNET STYLES OF BGA'S WITH NO LUCK. WINSLOW HAS EVEN HAD TROUBLE RE-BALLING OUR BGA'S. THEY SUGGEST LONG BAKE TIMES, DIFFERENT FLUXES...ETC NOTHING HAS WORKED PERFECTLY. THE PREFORMS ARE B


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