Electronics Forum | Thu Sep 03 22:03:32 EDT 2020 | SMTA-64386139
Both conditions are acceptable for this bottom brazed flat pack package. The solder coverage must be within 0.070 inch of the lead/package interface per MIL-PRF-38535, paragraph A3.5.6.3.4.a. While that requirement could allow for a gold gap near t
Electronics Forum | Wed Aug 13 22:23:24 EDT 2008 | davef
8.4 * SAC305 => 7.36 * Sn-3.5Ag => 7.5 * '....in' [96.2Sn-2.5Ag-0.8Cu-0.5Sb] => 7.39 * Sn-4Ag-0.5Cu => 7.39, 7.44 * Sn-3.8Ag-0.7Cu (Multicore solder) => 7.5
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Mon Mar 30 12:51:40 EST 1998 | Justin Medernach
| Hi | Anybody got advice on the online storage of sensitive ICs. ie dessicator cabinets with Nitrogen or dry air. I am looking at Nitrogen, but it is a costlty option. Appreciate any inputs. | Rgds | Liam Liam, Depending on the amount you need store
Electronics Forum | Tue Dec 15 12:23:47 EST 2009 | swag
I have moved golden boards from chains to mesh as I got tired of fishing t-couples under the chain rail. I saw a 3-5 deg. decrease on top-side parts peak temp. (all t-couples were on top side). I had to bump zones 6 and 7 a few degrees to make up f
Electronics Forum | Tue Feb 28 17:45:56 EST 2012 | acsscott
So, got the Topaz X up and running. It has (4)FNC nozzles on 2, 4, 6, 8, and (4)74A Nozzles on 1, 3, 5, 7. We are trying to optimize it to pick up 8 components, then move over the camera, then to the PCB and place them. In the Mount data, we load
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Wed Jan 26 21:30:06 EST 2000 | Dave F
Tuan: Consider Sn 96.5/Ag 3.5 or Sn10/PB88/Ag02 also. As Glenn says, you had better get rid of that gold or you will never have a shiney connection. Not that a shiney connection means anything about the quality or reliability of your soldering. M
Electronics Forum | Thu Jan 27 14:16:14 EST 2000 | Tuan Bui
I've tried Indium NC-SMQ92(96.5Sn 3.5Ag) on these MCMs and achieved only marginal wetting on pads and parts. The good wetting is what I try to achieve, shiny is what my engineers want (Prototype environment). Does pre-cleaning the PWBs in ultrasonic
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