Electronics Forum | Fri Jun 18 10:24:12 EDT 1999 | John Thorup
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Electronics Forum | Wed Jun 03 01:06:13 EDT 1998 | Mike Moninger
| We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not al
Electronics Forum | Mon May 11 17:35:01 EDT 1998 | Steve Gregory
On 11 May, 1998 Todd wrote: | We are having continuous bridging problems with the trailing | leads on a 26-pin D-sub through-hole connector. The pitch is | 0.100". The connector is going through the wave at approximately | a 20 Degree angle. Does
Electronics Forum | Tue Apr 14 09:38:07 EDT 1998 | Earl Moon
| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X
Electronics Forum | Tue Apr 14 09:01:36 EDT 1998 | Justin Medernach
| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X
Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan
Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).
Electronics Forum | Thu Apr 03 11:17:17 EST 2003 | rdr
Well, first off now I'm just starting to believe that we are fracturing again. But here is some more input D1 ENIG? I would not have thought that they would be but as usual you are probably right. D2 Again I would have to agree about it should affe
Electronics Forum | Fri Aug 06 08:38:25 EDT 2004 | Bob R.
You don't mention the board surface finish, but BGA's on NiAu are prone to brittle fracture in the Sn-Ni intermetallic on the board side of the joint. You may not be able to see it visually, but it would show up in a cross-section. In-circuit test
Electronics Forum | Thu Sep 28 09:19:05 EDT 2006 | realchunks
Apart from recommending a placement machine since I don�t know you product, part mix or tact time; I would just like to point out a few other things to consider when choosing a different placement machine. Feeders are a big thing. Mydatas are good
Electronics Forum | Mon Oct 08 15:41:33 EDT 2007 | bbarton
Worked for MPM for many years, and this sounds like a fairly common problem which is easy to fix if you can answer a few questions, several of them already asked... 1. Is this happening only on this board (if the answer is yes, this is a good thing!
