Electronics Forum | Tue Sep 09 12:05:44 EDT 2008 | tonyamenson
First and fore most is to find your paste manufacturer spec sheets. Read it over several times and let it all sink in. Then call them with questions as they want to keep your business so their engineers want to help you use their product. I assume y
Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef
Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli
Electronics Forum | Thu Jun 24 12:43:08 EDT 1999 | Earl Moon
| | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody h
Electronics Forum | Thu Jun 08 17:13:41 EDT 2006 | davef
We don't agree that "a little to the top would just even things out". The raw flux on the top of the board never touches the wave and so, does not receive the proper amount of heat for activation, except at the through hole barrels. * We assume WML
Electronics Forum | Tue Mar 10 21:40:27 EST 1998 | Carl mitchell
| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak
Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef
Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa
Electronics Forum | Fri Jun 08 11:35:16 EDT 2007 | patrickbruneel
80-90% of an average SM component is non wetable (pushing away solder). So if you would use a single smooth lambda wave (massive amount of molten metal) the negative force of the non-wetable part of the component would be so high that the solder wou
Electronics Forum | Mon Nov 09 07:21:02 EST 2009 | CL
Good Morning, I have seen many posts regarding BGA voiding being excessive and what can be done to better the condition. I have a customer that has an assembly that we have had a diufficult time with. We have spent a lot of time debugging the proces
Electronics Forum | Mon Sep 29 16:38:07 EDT 2014 | rgduval
These papers are a good place to start when learning about profiling: https://www.smtnet.com/library/files/upload/374_RSS_vs_RTS_revised_12-99_(no_pics).doc http://www.ipcoutlook.org/pdf/best_practices_reflow_profiling.pdf If you're having a lot o
Electronics Forum | Fri Feb 23 09:35:36 EST 2024 | emanuel
We have the standard profile as a template made according to the solder paste specs. For some boards we measure the result at 2 points, on the board itself and on top of a sensitive SOT263 module and adjust accordingly. The solder paste is well kept,
