Electronics Forum: all (Page 1181 of 1499)

Coating Brush Touch-up

Electronics Forum | Tue Dec 02 14:31:48 EST 2008 | dontfeedphils

Hey guys, just joined the site and I'm looking for some help. In our coating department we are running a Asymtek C-740 with a Jet and film coater. The coating that we are using is Humiseal 1B73 acrylic. The problem that we are having is that the C

SN100C alloy positive and negatives

Electronics Forum | Wed Dec 24 15:28:17 EST 2008 | edmentzer

We use SN100C for wave soldering and hand Lead free soldering and have had very good results. The wire cored solder for hand soldering flows good and makes very good solder joints. The SN100C in the wave solder machine also works very good. We use

Quick Turn Around for an EMS Provider - Brainstorming

Electronics Forum | Thu Jan 15 12:44:23 EST 2009 | jwolvans

I think it might be useful to differentiate between proto-typing and volume production builds. With a proto-type, I spend very little time preparing documentation as I'm right on the production line baby-sitting the product from start to finish. This

Soldering oven

Electronics Forum | Mon Jan 19 08:37:16 EST 2009 | lkpdsund

Hello all! We possess a speedline electrovert omniflo 7 reflow oven at my site. Last week we examined how the solder profile was affected by fan-speed and by providing the soldering process with compressed air(O2) or nitrogen(N2). We also ran the sa

Soldering problem with Au plating PCB

Electronics Forum | Sun Jan 25 17:40:16 EST 2009 | cuperpeter

Hello All, I have a problem with nonwetting Au finish after second cycle of reflow soldering doublesided boards. Solder nonwetted pcb pads (is wicked to component terminations) Either these pads or some of non component pads became discoloured from

Soldering problem with Au plating PCB

Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter

Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became

lead free joint finish

Electronics Forum | Wed Jan 28 21:47:56 EST 2009 | padawanlinuxero

Hello! I am having trouble with the new changes from lead joint to lead free joint, we are working on change to lead free, I am using a 3 zone oven reflow, the zone temps are : zone 1 zone 2 zone 3 (top and bottom) 128 208 260 th

Damaged Components by Reflow Process (Process Window)

Electronics Forum | Wed Feb 04 09:58:50 EST 2009 | dyoungquist

As was stated before, you need to have oven temperatures (profile) set such that you get good solder joints with the paste you are using. And definately run a profiler through yor oven to verify it is working properly. As for components, most data

assembly cleanliness and ionic testing

Electronics Forum | Thu Feb 12 11:57:59 EST 2009 | jmiller

i have searched the forum for hours. read all the threads that deals with cleanliness and ionic testing. (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=40295) (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=22603) (http://www.

High complex board manufacturing

Electronics Forum | Tue Mar 03 03:02:17 EST 2009 | emmanueldavid

25% out of Lands in PCB, Insufficient/Inconsistent Alloy deposition which causes for poor Tackiness between Device Spheres & Paste deposited. Also note that Aperture Opening Designs in Your Stencil draws a huge role for these defects. 4. Placement: P


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