Electronics Forum | Tue Apr 25 22:16:31 EDT 2006 | KEN
I agree with Russ. The problem is your thermal isolation is so small 1/16 inch. Also, most ovens measure temperaure in the plenum. You don't solder in the plenum. Therefore, you have a intermidiate "zone" temp. mixing between the top and bottom
Electronics Forum | Sat May 13 00:17:40 EDT 2006 | George S
I had Mydata for several years, and got a Juki 2060R about 8 months ago. If I had to choose today, it would be Juki again. The features which help me are bank changing, where I can set up offline and change over in two minutes for all feeders. The
Electronics Forum | Wed May 03 15:00:44 EDT 2006 | patrickbruneel
It all depends on process, design and environment in which the contacts are used. Both have excellent conductivity characteristics Both don't oxidize over time On the other hand gold is much softer then carbon, and after hitting that contact a gazil
Electronics Forum | Fri May 05 09:52:52 EDT 2006 | Rob
I think perhaps you should revisit the choice and take another look at Universal Advantis, I-Pulse M2 & M4(low cost Assemblion), Samsung SM320 or CP45 Neo, Contact Systems C5, Fuji XP series, Juki KE2060, and Siemens Siplace. There is nothing wrong
Electronics Forum | Wed May 10 11:03:04 EDT 2006 | Mike Konrad
I would be far more concerned about the flux residue intentionally left on the board than the �dust bunnies� sticking to the flux. In �perfect� no-clean applications, flux residue, although present, is nearly invisible and marginally conductive. In
Electronics Forum | Wed May 10 12:13:16 EDT 2006 | scombs
We have a 6 up panel with a 1206 part .082" from the board scoreline. After depanelization when we run the board through ICT it fails for a short at that location. We have visually inspected at high magnification for any cracks in the body and at the
Electronics Forum | Thu May 11 12:44:04 EDT 2006 | slthomas
One of our customers' products has a couple of adjacent 0603 packages (one resistor, one cap) that are .010" apart. They are side by side, not end to end. The adjacent pads between the two parts are electrically connected so bridging isn't an issu
Electronics Forum | Thu May 18 19:45:32 EDT 2006 | grantp
Hi, The tin flush is a good idea, and better than the suppliers suggestion of filling with lead-free solder which is much more expensive. I guess we won't be leaving a KG of solder in the bath, but based on your experience, how much remaining sold
Electronics Forum | Thu May 25 03:31:17 EDT 2006 | slaine
Hi I manufacture ceramic parts that have a terminations that are palladium/platinum/silver or any combination of the 3. Termination Ink usually consists of 3 main parts the alloy, glass frit and binder. Binder is to help bind everything together whi
Electronics Forum | Tue May 23 09:58:35 EDT 2006 | flipit
I would take a BGA over a fine pitch QFP any day of the week. Unless it is a BGA with a high ball count, place them by the body if you don't have upward looking vision. Make sure your reflow process is good and the parts are placed in the correct o
