Electronics Forum | Sat Oct 13 16:42:35 EDT 2001 | kenbliss
I agree with EMC based on what you described, and they build good pallets along with a few others, a small word of caution is that pallets are bit expensive typically several hundred dollars or more each. So if you find that is the road you go, be s
Electronics Forum | Tue Oct 16 11:53:04 EDT 2001 | raton
When only a few components are off placement? You'd like to say no tweaking of any kind, anywhere, by anybody (but me). But you're not there to run to their rescue all hours of the day and nite (almost but not quite), and getting product out the do
Electronics Forum | Thu Oct 18 06:29:20 EDT 2001 | Yngwie
Dave, yes, your assumption is right, We only do washing after the second reflow. The timing from the post primary reflow to wash is no longer than 2 hour. The line config is as such : DEK265 � 3x MV2F- 1x MSF � BTU - AOI � DEK265 � 3x MV2F � 1x MSF-
Electronics Forum | Tue Oct 23 08:38:52 EDT 2001 | MikeF
Dave, Thanks for the suggestion on the used equipment brokers. I had done a search of the Marketplace for this machine, but should have thought to contact one of the brokers. Vitronics can sell me a manal, but has noted the manual does not have any
Electronics Forum | Wed Oct 31 18:00:51 EST 2001 | Jonathan Mitchell
Hi All! In the near future we will begin to take on products that require a reflow process on both sides. We will run the backside first (smaller components) to reduce the chances of a part falling off during the second reflow, but my question is abo
Electronics Forum | Sat Nov 03 05:19:59 EST 2001 | Ben
Hi I have question about thermocouple type use for Super M.O.L.E. I found in some article that type K T/C (Nickel-Chromium vs. Nickel-Aluminum) may suffer from temperature cycling hysteresis at above 250 degree C and also diffecult to solder. Now
Electronics Forum | Tue Nov 13 11:22:50 EST 2001 | fmonette
Dave, Hany, I was actually surprised to hear that topside SMT components can reach such a high temperature during wave soldering. If this is the case then the concern for component damage is very valid. This morning I discussed this issue with Jac
Electronics Forum | Thu Nov 15 13:51:23 EST 2001 | jhingtgen
John, To answer your question, we have a number of customers that are using this process, Pumpprinting very successfully! If you would like to contact myself I can provide you with some very good references that will be able to answer all your ques
Electronics Forum | Fri Nov 23 03:40:09 EST 2001 | ianchan
Hi All, agree 100% on product characteristics SPC, and do find process indicators such as paste Volume, useful to monitor via SPC, the printing process, as printing constitutes "70% cases of SMT defects". We juz purchased a 2nd hand CyberOptics 3D
Electronics Forum | Tue Nov 20 12:48:40 EST 2001 | tony_sauve
We recently experienced a problem w/voids (up to 65%) in uBGA solder joints. The only joints that have the problem correlated to pads which had blind 0.006" via's in them. The via's only extend down 2 layers, of the 18. 21 BGA's on the PCB, only expe
