Electronics Forum: bga and pad (Page 46 of 159)

BGA: reworking BGAs, testing and inspection

Electronics Forum | Thu Feb 11 15:07:49 EST 2010 | hegemon

With regards to the rework, size and mass of the PCBs is important, in addition to the size of the components that are to be reworked. You might be in the game with $6K (APE Chipmaster Hot Air machine with Preheater or similar setup) if you have sma

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory

Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W

0402 tombstoning and dewetting on QFP256 trade-off

Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t

Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 09 15:46:29 EDT 1998 | Aric Parr

| Hi there Gary, | Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly

Laying down and holding large components

Electronics Forum | Thu May 22 14:16:40 EDT 2003 | MikeF

We need more information to give you a good answer. Is this a leaded part (axial or radial) or smt? How big is the part, how much weight per lead? What is the end use environment, will it see any vibration? or temperature extremes? Some general com

Weak joint strength and black residue

Electronics Forum | Fri Jun 08 17:22:51 EDT 2007 | naynayno

We have been producing an IMS assembly with SMT dpak's for some time. However, we recently encountered a new problem by chance - the parts can be flicked off with a finger nail. I state by chance because the solder joints are wetted and shiny with

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 17:00:34 EDT 2007 | jmelson

Oh, sure, on fine-pitch parts you need a microscope or at least a good magnifier. But, OK, you have some kind of contamination. Solder is one thing, but where are these stainless, aluminum and copper particles coming from? Stainless makes me think

Pick and Place vs CAD File

Electronics Forum | Fri Nov 24 22:32:12 EST 2017 | myke03o

Some Customers normally don't share CAD data in order not to copy the design. What you can do is use the Pick and Place file then plot to the pcb paste/silkscreen layer of the gerber using software. Not sure if your universal machine can load a gerb

Stencil Bleed - Bridges and Solder Balls

Electronics Forum | Mon Aug 14 01:29:49 EDT 2023 | calebcsmt

I have noticed on a recent project, the QFN and SOP solder deposits do not seem very uniform and have been leaving little balls, whiskers and icicles of solder paste coming from some pads which leads to bridges. https://imgur.com/a/lqw5RF1 I have u

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va


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