Electronics Forum | Wed Jan 23 19:44:45 EST 2008 | hegemon
In addition to the pre-emptive steps mentioned above, in my experience there are certain BGA package designs that seem more prone to that corner bridging. I have seen some packages that will essentially "curl" down at one corner as the package begin
Electronics Forum | Tue Apr 13 17:48:54 EDT 2004 | davef
Q1: Can anyone explain to me about the effect of their mixture. A1: What is their �mixture�? Q2: What enhancement does my BGA will have when using a WS paste flux with regards to corrosion, 25 years life cycle of the solder joint. A2: Tough to say
Electronics Forum | Thu Jan 06 21:41:20 EST 2005 | James Khor
You can using Ersa IR550A Rework System. The unit was NOT using any hot air process. IR550A Rework System is worldwide the only system with a genuine closed loop control system. Which employs the current temperature at the component in order to regul
Electronics Forum | Mon Mar 21 02:41:29 EDT 2011 | kemasta
Hi It's me again. Our products need to pass a chamber test 45c/36hrs after the PCBA completed batch of functional tests and assemble in to case. We found 1 unit was functioning for 24hours in the chamber, but hang after that. We tried to re-boot the
Electronics Forum | Wed May 29 19:04:39 EDT 2002 | russ
I have heard of using diamond apertures for BGAs to tell you in XRay inspection if you reflowed (diamond means that paste did not reflow) that is the inly thing I coud think of as to why you qould want to do this. Russ
Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef
Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?
Electronics Forum | Fri Jun 28 11:25:01 EDT 2002 | dason_c
You need to check your pot temperature and the board surface temperature. You know the melting point of the 63/37 at 183C. If your top side surface temperature is above this point and second reflow may happen. Also, the board will warp and may cau
Electronics Forum | Mon Mar 21 12:43:20 EDT 2011 | hegemon
Passives first reflow, and BGAs second side reflow. Uses only one heating cycle for your BGAs, and the passives will stay in place just fine given correct profile parameters. There are a few exceptions, but this is generally how it is done. My $.02
Electronics Forum | Mon Jul 17 09:09:42 EDT 2023 | tommy_magyar
Things I would check: - solder paste - reflow profile - stencil printing parameters including support, stencil itself and squeegee - MSL procedures - inspection between pick and place and reflow to check paste printing (ideally SPI) Hope this h
Electronics Forum | Tue Aug 15 14:32:23 EDT 2023 | emeto
I think this part has terrible thermal balance. I assume in reflow process the part is bending so much that it will cause the shorts you see. I would suggest you get one of these beautiful hi temp cameras and record the reflow process. This video sho
