Electronics Forum | Tue May 20 17:09:13 EDT 2008 | davef
Sorry, we didn't do a good job of understanding your question. For more on delamination, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54655 ... but we're not so sure that this is a straight delamination issue, because: * One
Electronics Forum | Fri May 23 09:37:14 EDT 2008 | llaerum
Water Soluable.
Electronics Forum | Tue Jun 03 12:49:29 EDT 2008 | operator
If only my company would pay for a membership to IPC......
Electronics Forum | Wed Jun 04 00:13:18 EDT 2008 | operator
Very informative article. Thanks Dave.
Electronics Forum | Thu Jul 10 22:46:08 EDT 2008 | davef
We'd like to see pads on the board that closely resemble those on the interposer.
Electronics Forum | Mon Jul 07 12:50:18 EDT 2008 | mbnetto
*VIA VN896CE; *VIA VT8237A; Thanks!
Electronics Forum | Wed Jul 16 18:21:20 EDT 2008 | emti
BGA Placement is not easy as we think, Mainly you have to make sure you don't have acceessive amount of paste, try to paste your board as it covers full ball, make sure it is not short before you place any part. If you placing the BGA by hand be car
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