Electronics Forum | Thu Feb 23 17:45:18 EST 2006 | Robert Joosten - PrintTec
Before doing anything; contact http://www.ape.com and ask for Casey Schue; he will tell you and show you the real bga rework equipment; the other brands just lack the power to do the job properly; I've seen too many people already buying inefficient
Electronics Forum | Sun Mar 12 01:58:44 EST 2006 | grantp
Hi, We have been soldering lead free BGA's onto products with lead based paste, and we have had no increase in defects at all. We have used a standard lead paste profile, so we are not altering the temps anything from what's recommended by the paste
Electronics Forum | Thu Mar 09 16:14:23 EST 2006 | operator
We are fixing to run a board with both pb and pb-free BGA's..double sided.. The board is RoHs compliant so I could go either way on the solder paste. I was thinking pb-free paste would be the best bet. Any opinions would be greatly appreciated. Th
Electronics Forum | Mon Apr 24 04:21:10 EDT 2006 | vpha
I have seen a Spark 400 at Apex Show. It appears to be a good Machine to do rework on BGA and others. I have used a SRT Summit 1100 Machine to do most BGA Reworks and want to have a Machine which can do rework better. Does anyone has any knowledge
Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM
So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr
Electronics Forum | Thu Jun 01 21:14:21 EDT 2006 | roadhound
Hello, We repair mobile (cellular) phones, and most are now having their u-BGA IC's underfilled. Can anyone suggest methods for removal of the IC's ? The manufacturers are very vague when it comes to this process, but are starting to get tired of u
Electronics Forum | Thu Jun 22 04:25:26 EDT 2006 | emeto
Grant, The best rule is- "If it works don't touch it". What I mean is check your component datasheet. Max allowed temperature should be there. You know the profile of your reflow oven and the temperature reached during reflow. So if there is no conf
Electronics Forum | Sun Jun 25 23:17:30 EDT 2006 | Bolos
anyone who can comment and win for me..I prefer a BGA but my designer needs to add 3 dollars for the boards ..how to beat this 3 dollars from manufacturing pooint of view?..with a 15K volume of boards..therefore i need to beat 45K$ ...hell[p[p[[[...
Electronics Forum | Wed Jun 28 21:50:18 EDT 2006 | adihsr
BGA is better- in terms of 1.0 no bent leads or coplanarity problems 2.0 self align on solder pads 3. easy solder printing 4. large pitch ...I think those who goes for QFP have not had a strong SMT experience. Do not be hurt byt this is a basic SMT D
Electronics Forum | Thu Jun 29 05:48:30 EDT 2006 | Loco
The first 3 points are process problems in your own plant. These should be solved anyway. 4th point isnt allways valid. 2 reasons pro qfp: -inspection and repair, do you have a good Xray system? Do you have a good BGA repair process?
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
98 Elm St.
Portland, ME USA
Phone: 1-207-775-6139
