Electronics Forum | Mon Aug 10 21:52:34 EDT 1998 | Dave F
| | | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not
Electronics Forum | Tue Aug 11 07:51:57 EDT 1998 | Earl Moon
| | | | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, n
Electronics Forum | Fri Jul 24 13:41:05 EDT 1998 | Bob Willis
Sorry guys have a look at this list of component weights and then work out the surface area of the lead/pad and then come back on the PLCC issue. Chip 0805���� 0.007g������ 2 Chip 1206���� 0.009g���� 2 Chip 1210���� 0.012g���� 2 SOT23���������0.008g�
Electronics Forum | Thu Apr 15 10:05:50 EDT 2010 | dwonch
Hi all, Long story ahead.... We are having issues with board vendors on some of our higher layer count (thick) boards. Specifically under BGAs with high aspect ratio vias (14:1). We are using ENIG finish and a lead free process. Basically we get t
Electronics Forum | Fri Feb 25 14:34:44 EST 2000 | Ioan
Larry, the best paste thinner is the one that your paste supplier recommends. You should check with him. We have no problems removing the no-clean paste with alcohol. If you want to give it a try, make sure you use IP alcohol, not alcohol based flux
Electronics Forum | Tue Dec 12 17:54:04 EST 2000 | ralph
I've had this problem myself, though in using water soluables. But the process to eliminate it is still the same. There are three possible causes for this to occure. Too much humidity, to much solder, and too much heat. Are you leaving the paste
Electronics Forum | Wed Nov 22 15:09:52 EST 2000 | Finepitch Services
Chryzs, I've used AIRVAC and SRT (with their old adjustable 4 piece nozzle system). I also saw the APE Chipmaster... Here's my 2C after all that: Whoever claims he/she has a user friendly system is a big liar. The words are correct but the order is
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
Electronics Forum | Tue Nov 07 10:25:19 EST 2000 | Thomas Ballhausen
Thank you for your kind contribution and efforts in helping me. I just found out we have been talking different units; my microns were micro meter ...? So, let me get things right now: the substrate supplier confirmed the following data: Cu foil +
Electronics Forum | Thu Oct 26 12:36:02 EDT 2000 | Sal
Guys! witnessing a problem i've never seen before.Manufacturing a mixed technology with HASL finish, BGA,QFP's,fuses etc..etc. I've profiled the product, but what i'm witnessing is really weird. I've got a 0.020" QFP which is at the edge of the board
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