Electronics Forum | Mon Nov 05 13:46:14 EST 2007 | ck_the_flip
That's where this website falls short. Sorry to b*tch, but there's lots of people who post here whose primary language is NOT english, and you know what they say... "a picture is worth a thousand words." Original Poster guy...try "Image Shack" to s
Electronics Forum | Mon Nov 19 18:58:28 EST 2007 | jmelson
On big chips, we use a tape printing device, I think it is a Brother PT1750. We have a small device, though, that is in an SO8 package, and the only thing we've come up with is to scratch a product letter code and the program date with a stylus. Th
Electronics Forum | Thu Nov 29 16:00:03 EST 2007 | jmelson
Desoldering often applies a LOT more heat and thermal stress to the part, and maybe mechanical forces while everything is hot, to get the part free of the board. So, a lot of damage might be done there, making post-mortem harder. Without the leads,
Electronics Forum | Tue Jan 01 22:50:53 EST 2008 | fastek
To get beyond the 36,000 cph threshhold the turret manufacturers had to focus on ways to get the boards in and out of the machine faster. This also included loading more boards inside the worknest. The end result in Fuji's case (CP-643), was a table
Electronics Forum | Tue Jan 15 16:44:54 EST 2008 | gregoryyork
I found some machine manufacturers put convection nozzles in line parallel with each other instead of staggering them so you get a nice parallel line up the board where there is no flux be it no residue alcohol or VOC Free. The best I could find was
Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef
Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad
Electronics Forum | Fri Feb 01 18:44:26 EST 2008 | jmelson
I looked at a number of small bench-top batch ovens and saw two things. First, they got VERY expensive when you got above the very smallest units. Mine will fit an 8 x 12" board. I still have to do one that size and see how uniform the temperature
Electronics Forum | Wed Feb 06 14:36:07 EST 2008 | dphilbrick
We had a customer that had 5 BGA's top and 2 bottom and several other assemblies that had 4-7 total BGA's that required WS. Our average build quantity was 2200 boards a month. We used high end Maytag dishwashers and a little Amterge(SP?) Took them t
Electronics Forum | Mon Feb 04 19:24:37 EST 2008 | swag
We have an Advantis and it's great for low volume, high mix (flexjet head). If you have good CAD data to upload, it takes little time to program as you can update vision on parts and placements while you are actually building boards ("NPI mode"). I
Electronics Forum | Tue Feb 19 12:41:20 EST 2008 | patrickbruneel
Yes dendrites can cause electrical shorts. The first stage of dendritic growth is a dark fern like pattern which reduce surface insulation between anode and cathode. In a more advanced stage the ferns transfer the plating metals of the conductors and
