Electronics Forum: board (Page 341 of 1638)

Re: Conformal coating of smt boards

Electronics Forum | Wed Mar 01 13:06:36 EST 2000 | Graham Naisbitt

$100K for a full in-line. We can do conventional spray at 30 to 50% less but you must mask components you don't want to coat. If they are on 1 end only of the board, then dip coat which is the least expensive option starting at around $12K for up to

Baking PCB's before Assembly

Electronics Forum | Thu Feb 24 14:58:11 EST 2000 | Greg denham

Does anyone have any information on baking boards to remove moisture before reflowing and waving assemblies? I've been told that we should do this to stop such problems as delamination of boards, blow holes, solder balls, etc. I don't know have any e

Re: Baking PCB's before Assembly

Electronics Forum | Thu Feb 24 18:08:42 EST 2000 | Travis Slaughter

Baking boards, especially multi layer, will help with blowholes and delimitation, but not with solder balls. Normally about 120c for 1 hour or so is sufficient. I usually will not go to this trouble unless a board has proven to be a problem or if th

Re: Baking PCB's before Assembly

Electronics Forum | Fri Feb 25 10:23:46 EST 2000 | K3 Equipment

Greg, If you are having a problem, i would first check board manufacturers process. Also are they shipping boards to you in seal packages (a must if you are in a humid part of the country.) Most of the time with a few simple process controls moistur

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX

Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar

Re: Reliability of power module soldering

Electronics Forum | Tue Feb 22 04:29:29 EST 2000 | Gwen Z

First I apologize for my poor English writing. we have no heat sink fins and active cooling with power module. when the board is transported,the vibration of board and power module will shotten the solder joint lifetime. if we just solder it withou

Need Help: Product Testing

Electronics Forum | Thu Feb 22 12:42:02 EST 2001 | moncav

Dear SMTneter's; I am looking for a few board manufacturers to evaluate a new product. This device is a tooling fixture that conforms to any board profile for support during single or double side printing or placement. It's clean, simple and very r

Round Solder Lands

Electronics Forum | Mon Feb 26 07:19:47 EST 2001 | PeteC

Has anybody ever seen round solder lands for 0603 chip components? I've got a new board to build and it has round lands. I've asked the design enegineer why he chose round lands. Waitin for the answer. And the funny thing is all the 0603 chips don't

Bottom side process question

Electronics Forum | Fri Mar 16 17:50:45 EST 2001 | djarvis

Steve, I did this several years ago on a terribly designed board that left a lot of joints unsoldered after the wave. It works OK. This was a bog Irish board with nothing fancier than SOP packages. Glue was Amicon D125. Happy St. Patrick's Day everyo

Punch Force

Electronics Forum | Thu Mar 29 20:39:01 EST 2001 | huat

Hi, Now, I'm working on depanalising equipment. The operating concept of this equipment is punch on the board for depanalising panel boards using Die-set. Now, I'm trying to determince the punch force using some formula, which I can't fin


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