Electronics Forum: bottom (Page 21 of 231)

Tomb-Stoning. What's going on here?

Electronics Forum | Tue Jan 17 11:52:07 EST 2006 | pms

Got a wierd one here, 0402's tomb-stoning. Scenerio---- Double sided PCB, paste both sides, 0402 on both sides. Reflow bottom side first--- no problems. Reflow topside next----no problems with topside components, BUT, the bottom side that was ref

Fillet Tearing

Electronics Forum | Thu Mar 23 12:40:37 EST 2006 | patrickbruneel

Russ, On a serious note it's impossible to optical see the bottom. The only way to verify is cross sectioning. Tin can't handle stress very well unless lead is added to make the alloy more elastic. We come back on the subject when the "field" starts

Reflow temperature setting

Electronics Forum | Thu Jun 08 03:40:32 EDT 2006 | aj

Hi, I use convection reflow and both top & bottom settings are the same. Is the part too heavy to rely on surface tension? there is an equation that can determine this (aswell as real test i.e. part falling off) We have some SIM Card holders on bot

Need help for setting up an assembly line

Electronics Forum | Thu Jun 22 08:49:10 EDT 2006 | russ

Okay I was not thinking of the Suzuki, So I would not have any input there. Zones to me does not include the cooling, I also do not count the top and bottom individually as zones. So to me an 8 zone oven would have 16 heaters that you could set, 8

Vitronics SMR500

Electronics Forum | Mon Jan 22 05:37:35 EST 2007 | dave

Hi All, One of the switches tripped causing no power to the Bottom Cell Inverter . This was reset and Inverter seems to be working fine but the Bottom Blowers are not working which is causing cold joints etc. I am waiting on Electrical Schematics f

Adhesive printing with double side board

Electronics Forum | Tue Jul 24 10:29:10 EDT 2007 | ed_faranda

Is there a reason why you want to wash the board before wave?!?!? What is your process flow? I run bottom side of my boards first, then top just to make it easier to setup (easier to put those support pins around those smaller components). But,

SMT before through-hole

Electronics Forum | Tue Aug 14 10:51:18 EDT 2007 | erhard

standard procedure for this would be to solder SMDs on the bottom side and the LEDs all at once on the wave - if the layout is ok for the wave. You would have to glue the SMD components, for this you would have to use a glue dispenser or a special hi

PanaPro DSM

Electronics Forum | Tue Sep 11 11:50:41 EDT 2007 | brulal1

Went we buy our Panasonic line we have the DSM, I never use it because we do mix several PCB on the same set-up and want to produce top a bottom on one PCB before switching on another one, DSM don't work that way He will optimize all the PCB so we wi

What caused this reflow issue?

Electronics Forum | Wed Apr 16 09:25:55 EDT 2008 | hussman

Do you specify copper weight on your boards? This could be the difference between the the boards. Also the finish will be different between the boards as well. These two factors are enough to cause bottom side parts to reflow and fall off. In eit

What caused this reflow issue?

Electronics Forum | Wed Apr 16 15:22:31 EDT 2008 | jdengler

This looks like it didn't solder the bottom side completely. The recipe for the reflow oven was not right and you did not hit a high enough temp at these locations to get a good solder joint. Then you saw the problem when you soldered the topside.


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