Electronics Forum: bumpy (Page 1 of 1)

REFLOW PROFILE NEED HELP

Electronics Forum | Wed Aug 24 09:42:23 EDT 2005 | james

That is what I was looking for. The profiles did not make much sense to me. We are getting alot of cold solder joints or bumpy solder joints.

PCB finish - Printhead vs Squeegee

Electronics Forum | Wed Sep 19 16:02:14 EDT 2001 | fcouture

Pad Metallurgy Used: >Is your question about this targeting the current industry capability of using tin plating technology on such small >pad dimensions? Actually I should have asked for tin/lead plating (HASL) and yes it's to have an idea on capab

Connector leads plating

Electronics Forum | Tue Dec 10 10:26:56 EST 2002 | davef

Questions are: * What is the current plating on the connector that is over the "plating of the leads is Nickel (99.9% purity)"? * What are the temperatures and durations at those temperatures that you read on these connector leads? * What solder allo

Connector leads plating

Electronics Forum | Tue Dec 10 19:30:49 EST 2002 | Vijay

Hi Dave, The peak temp on the leads is 216-218 Deg C and duration above MP (179 degC) is 55-60 sec. Alloy(solder paste) used 62 Sn,36 Pb 2Ag (Alpha WS 609 Ty 3 Water eash) This is a SMT connector wth Gulwing leads Gold plating on the PCB is 2-5 micr

Grainy SMT Solder Joint

Electronics Forum | Tue Apr 10 13:43:13 EDT 2001 | mparker

since you did not define what visual process you are inspecting with I will ask is this "grainy" appearance being detected with the naked eye only? Are you using magnification? if so, what power? Is this a SMT solder or through hole solder problem?

Voids in solder fillet

Electronics Forum | Wed Apr 16 13:19:13 EDT 2003 | Takfire

Thanks Russ! The origianal complaint from the customer was in regards to what appeared as "bumpy" appearance and "holes" in the solder fillet. This problem was originally presented as an appearance issue only. Further investigation by our DPA lab r

Voids in solder fillet

Electronics Forum | Thu Apr 17 10:38:02 EDT 2003 | davef

While Russ is correct that a little voiding is OK, your level of voiding [customer complains that the solder surface looks bumpy] doesn't give us the ol' warm and fuzzy about their process control. For background: * Search the fine SMTnet Archives.

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