Electronics Forum: casing (Page 161 of 246)

Air Quality in Production Floor

Electronics Forum | Fri Sep 26 12:23:23 EDT 2008 | stepheniii

How do you get your X-ray machine checked out? We had the tube replaced and they checked it then otherwise we would have the same guy we had in last year to check it out. But in any case we have a radiaton survey done at least once a year. I assume

stencil to pcb manufacturing tolerance

Electronics Forum | Fri Oct 31 06:55:35 EDT 2008 | andrzej

Answer on point 2 - I understand you send him gerbers of single PCB (?). In most cases you have panelized PCBs so to avoid problems with stencil first you should order PCBs and ASK your PCB supplier to send you back his gerbers of panel. There are so

BGA failure at Functional Test

Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70

Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f

localization of the temperature sensors on the pcb

Electronics Forum | Tue Feb 03 14:19:29 EST 2009 | grics

I would agree if you have a board to setup the process. But sometimes this doesn't work... If for some reason if the customers AVL has a Lead Free BGA and I am running Leaded paste (yes this really happens!), you will need to run hotter to get your

Conversion from SAC305 to SN100C

Electronics Forum | Wed Feb 04 10:24:05 EST 2009 | dyoungquist

We use SN100C in our selective solder process. The 3 keys to proper hole fill are applying a proper amount of flux, heating of the pcb and solder temperature. If either the pcb or solder is not hot enough, you may not get good hole fill. To adjus

New Oven Now Getting PCB Twist

Electronics Forum | Tue Feb 24 15:31:44 EST 2009 | pcbrookie

Wrongway - Interesting about the rails. I'll check to make sure operators are leaving a little 'wriggle room' on the rails in case they are in fact getting narrower in the middle. SWAG - I suspected the initial temp. might be a bit hot, thus causin

What are the best profiles for 3 zone ersa reflow?

Electronics Forum | Fri Mar 27 10:04:51 EDT 2009 | ericthered

We have been having problems with proper wetting when running mainly lead free but also leaded solder in our Ersa Hotflow 3. Solder either often looks grainy or doesn't flow over the whole pad. This is generally the case when my profile is 170 firs

Gerver vs. ODB++ in case of there's some Impedance control line

Electronics Forum | Fri Apr 03 02:15:23 EDT 2009 | roy1209

I've heard from my company's engineer that it'll be better to use Gerber format if there's some impedance control line . Because usually Gerber has code numbers in data and someone can easily refer to controlled line on the PCB and ODB++ doesn't have

QFN's and LGA's

Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge

Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value

Low Silver Solder Problems

Electronics Forum | Mon Aug 24 13:12:28 EDT 2009 | ghepo

OK Eric, maybe you're right. My suggestion is to proceed by exclusion. First perform the tape test. Is easy and without costs. You have used many similar PCB without problem, but from the same vendor ? Is my experience that in similar cases the qua


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