Electronics Forum | Wed Oct 20 07:09:12 EDT 2004 | mattkehoe
Not really. Our process is a solid solder deposition application so we are not placing components into the wet paste prior to reflow. We print the paste then reflow is without components, trying to create a meniscus which is then washed, flattened,
Electronics Forum | Wed Oct 20 07:42:24 EDT 2004 | rlackey
Hi Arman, There are a number of sites dealing with the Corona Effect all with different slants in how it applies to them (Astonomers, physicists, Radio enthusiasts, etc.), but the basic definition I remember from my physics lessons at school is as f
Electronics Forum | Mon Oct 18 22:15:11 EDT 2004 | KEN
I have two industry leading customers that have specific requirements for components to survive 30 seconds above 230C. In one case I have a custom ASIC that is heat sinked on the die (to the PCB). The sink pulls heat out of the lead frame very effi
Electronics Forum | Wed Oct 20 14:24:32 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Wed Oct 20 14:44:24 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Fri Oct 22 07:31:24 EDT 2004 | davef
We're unclear about what you're seeking, but in order to move the conversation along, are you looking for: IPC-SM-782A - Surface Mount Design & Land Pattern Standard ANSI Approved Get up-to-date land pattern recommendations for ball grid array pac
Electronics Forum | Fri Oct 22 11:53:53 EDT 2004 | C Lampron
Hi Christina, What would you be basing the yields off of? Is it solder defect, component placement, etc....? I have worked for a flex house for quite a few years. You are right. The Polyimide is very dimentionally unstable. (even more so on humid da
Electronics Forum | Sun Oct 24 11:20:57 EDT 2004 | sagan
Hello everyone. The company i work for owns a PM570L and a PM460. The PM460 recently came from service repairs and it has a problem that me and the technicians at Zevatech AG are trying to solve but i would like to hear from anyone with experience o
Electronics Forum | Mon Oct 25 21:19:06 EDT 2004 | davef
Q1: I thought we have a industry standard for this. A1: We're unaware of such a standard. IPC-7525 - Stencil Design Guidelines has a brief section on stencil inspection. We've talked about it previously on SMTnet. If you can't find it in the Archiv
Electronics Forum | Mon Oct 25 17:50:46 EDT 2004 | Mike
I work for a PCB Manufacture and I am looking for info on BGA Pull test or strenght test. I have a CM that is experiencing bga's with some weak joints. they are telling me that when they do their pull test the joints are breaking at the nickel inste
