Electronics Forum | Thu Nov 04 12:41:37 EST 2004 | cobar
Definetely 245�C
Electronics Forum | Thu May 25 09:09:43 EDT 2006 | cobar
Had the same problem with a batch of 0603`s nfrom Vishay. They eventually replaced the components after I proved that the problem was with the component.
Electronics Forum | Thu May 25 09:14:04 EDT 2006 | cobar
Print a number of pads of the 0603 on to a ceramic substrate. Then place the 0603 on the paste on the ceramic and refow. If the paste shows no wetting onto the component it will prove that there is a problem with the components solderability.
Electronics Forum | Tue Sep 19 18:11:06 EDT 2006 | cobar
Thanks for that,have you got a URL for them?
Electronics Forum | Thu Jan 31 06:38:55 EST 2008 | cobar
Wave too high,pot temp to high set to 245�C. Solder level too low.
Electronics Forum | Mon Jul 28 06:23:29 EDT 2008 | cobar
Please look up http://www.shanelo.co.za/Black%20Pad%20Index.htm and check out the article named"Soldering to gold a practical guide."
Electronics Forum | Mon Jul 28 06:13:35 EDT 2008 | cobar
Your problem is being caused by to much paste being printed.Reduce apeture size on stencil. http://www.shanelo.co.za/technical_paper_about_stencil_de.htm or http://www.shanelo.co.za/SMD%20Assist.htm
Electronics Forum | Mon Jul 28 06:28:04 EDT 2008 | cobar
Hi Debra.Baking must be above the evaporation temp of water.This leads to an oxidation problem on the components and affects solderability.Please follow the link and check out Totech on that page.http://www.shanelo.co.za/products.htm
Electronics Forum | Thu Sep 11 02:54:27 EDT 2008 | cobar
The 2 % is Ag.It is added to prevent leaching silver from the end caps of components.This alloy like 63/37 is eutectic and has a reflow temp of 179�C whereas 63/37 is 183�C.
Electronics Forum | Fri May 29 02:08:08 EDT 2009 | cobar
Check that you are getting an even spray pattern from the fluxer.Check that the chip wave nozzle is clean and if possible feed the PCB in to the wavesolder unit at 90 � or 180�.
