Electronics Forum: component (Page 181 of 1140)

Baking PWBs prior to wave solder

Electronics Forum | Mon Dec 16 15:10:56 EST 2002 | Randy Villeneuve

We do not bake any of our boards prior to wave solder. If we did we would have one heck of a large oven. I would assume you are concerned about moisture sensitive components. In most cases your top side parts should only get to 80 degrees centigarde

Epoxied Parts Falling Off

Electronics Forum | Tue Mar 11 11:56:20 EST 2003 | Mark

Please inspect the pcb were the components were "lost" Check if the glue dots were lef on the PCB.If so you have a component which has been contaminated.If the dots dont appear on the PCB,which is the more common of the 2,there is an adhesion problem

Production scheduling

Electronics Forum | Sat Mar 15 00:48:42 EST 2003 | Grant

Hi, We are looking for some software that can keep track of products, and the components they use, and the volume we sell. We use complex spreadsheets currently, however the number of components is making that complex. We would love to have some so

leadfree

Electronics Forum | Mon Apr 21 16:25:10 EDT 2003 | kris

Hi, As many must be aware a number of component manufactuers maybe shipping lead-free parts without part number changes. without knowing the datecode tracked on each component it would be difficult to trace components whether they are lead-free or

Thin Chip resistors and HSP 4797 T12W8P

Electronics Forum | Wed May 21 15:47:34 EDT 2003 | JB

We have an HSP 4796, if the feeder mechanism is the same, this may help you a bit. First make sure that the componet definition is right on the component library. Tape or Embossed. Second, the component thickness vs actual thickness. Is the pick u

High frequency application board V.S rework CSP

Electronics Forum | Fri May 30 04:20:59 EDT 2003 | Ben

Hi all I am facing the problem with reoworking CSP component for high frequency application boards. Our customer do not allow us to use tacky fluxes due to high frequency application and component has low standoff ,and the ball pad and ball size is

Optimal Speed for Universal Chip Shooters

Electronics Forum | Wed Jun 11 12:03:29 EDT 2003 | rmurtuza

I have the speed data set at 0.12S for the small caps and in addition to that I am using an overall tact time reduction of 14 to 16 seconds. If I use the default overall tact time then I have placement defects such as components being placed: 1. Twi

Manufacturing Software

Electronics Forum | Mon Nov 03 23:32:15 EST 2003 | Grant Petty

Hi, Does anyone know of some good software for managing component consumption in manufacturing and keeping track of what products use what components, and the consumption rates over time. This lets us forward plan component orders for future product

Oxidation

Electronics Forum | Mon Nov 17 21:30:10 EST 2003 | davef

Odds are that all of the completed product had corroded leads, if the components came from the same load / were processed similarly. ... but the issue is NOT corroded leads. The issue is well soldered connections. * If the solder connections on the

SMT Component Tape Standards

Electronics Forum | Wed Nov 26 10:46:45 EST 2003 | caldon

For a general rough rule of thumb I use Practical Components for programming our machines. Practical has a nice layout of most Tape and Reel components and sizes. We use this mostly for tape/ feeder allocation. But for QC, Specs, and Other Stuff we


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