Electronics Forum | Tue Mar 20 20:12:32 EST 2001 | davef
In response to a similar question Dennis Fritz [DDFRITZ@AOL.COM] Chair of the Alternate Final Finishes Committee of IPC (5-23d) said ... The Alternate Final Finishes Committee of IPC (5-23d) has nearly completed a round robin "conditioning" study of
Electronics Forum | Thu Mar 29 10:51:47 EST 2001 | Deon Nungaray
Hello Phil, AOI equipment has been around for a number of years. I remember evaluating a machine around 5 years ago. At this time the system was not able to learn right side up or upside down characters. Well, the newer systems have come a long way.
Electronics Forum | Thu Apr 05 12:25:01 EDT 2001 | davef
Talk about bucking the trend!!! OK, OK, I know some US military work still requires RMA. You�re both correct. Cleaning decisions for RMA fluxed boards are based on customers requirements. [Some do (clean) and some don�t.] Older US military speci
Electronics Forum | Mon Apr 23 17:30:08 EDT 2001 | davef
Step 1: Print paste on the board, skip placement, reflow the board, check solderability. Step 2: Goto Step 1. White Tin Solderability: The most common reason for solderability issues with the white tin surface coating during multiple thermal excur
Electronics Forum | Tue Nov 28 14:31:10 EST 2000 | rabell
This is certainly an excellent question. We have shied away from going web based for several reasons: 1. Yes - bandwidth is a real issue. Research into instructional effectiveness of computer based training shows that students lose interest if res
Electronics Forum | Mon Nov 27 12:38:10 EST 2000 | rabell
There are a number of issues here. One is having good benchmarks prior to training. Most companies monitor production issues like inventory, scrap, rework, etc. A good ESD program would be performing frequent audits and recording deviations. Hard
Electronics Forum | Thu Oct 26 13:56:08 EDT 2000 | ptvianc
Hello: Pre-baking laminates should only be performed:(1) to meet contractual agreements or (2) in response to an actual defect that can be traced to PWB water absortion. Besides the fact that a pre-bake is an enormous process "bottleneck," it also
Electronics Forum | Thu Oct 26 13:26:53 EDT 2000 | ptvianc
Hello: 1. Yes, it is necessary to reball a PBGA after removal from the board. Once the part has been removed, the quantity of solder on the balls is out of control. This condition will not only result in an unacceptable variation in solder quantity
Electronics Forum | Fri May 11 15:43:41 EDT 2001 | davef
More information would be helpful. For instance: * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about the board (ie, thickness, type, solder ma
Electronics Forum | Mon May 14 22:24:11 EDT 2001 | davef
The time over liquidous of the profile seems short. But then again, who knows? Based on what you told us, I'm guessing at a board fabrication problem, either measling or delamination. Probably the former, rather than the latter. [Now, we remember
