Electronics Forum | Mon Dec 31 08:51:58 EST 2001 | davef
Warp depends on: * How close the board gets to its Tg during the solder cycle (the closer you get to the Tg the worse the warp gets) * Amount of copper on each side and the balance between the two * Thickness of the board * Overall length x width * T
Electronics Forum | Mon Jun 14 14:39:12 EDT 2004 | davef
HASL Thickness: * HADCO DFM manual specifies a nominal thickness of 50-1500uin with an option for 100-1000uin * Merix DFM manual specifies 30-200uin IPC-6012, Class 1, 2, 3 do not spec a HASL thickness at all but only require that full coverage is m
Electronics Forum | Mon Feb 22 14:02:17 EST 1999 | Michael Allen
We have resorted to adding a ring (or donut) around our 0.040" round fiducials. The donut acts as a "plating thief" to minimize the thickness of the copper plating (in the case of HASL finish) and of the solder plating (in the case of solder-plated
Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
Electronics Forum | Thu Aug 11 21:43:19 EDT 2005 | Ken
Those temp stickers are useless unless you can stick them into the copper barrel. They can only determine "skin" temperature which has nothing to do with what is happening in the barrels. Your solder is filling the barrel then going cold. I'll gua
Electronics Forum | Wed Sep 27 17:24:08 EDT 2000 | Wolfgang Busko
Ashok: Plating thickness and ductility of the copper are things to look for. If it�s a crack where two layers are pressed together one possible cause could be bad process parameters while pressing these layers together at the PCB shop with the resul
Electronics Forum | Wed Feb 21 21:01:57 EST 2007 | davef
Yes. Heat reduces OSP solderability protection thickness. For instance, many OSP are shot at the end of the first reflow pass and the exposed copper is free to oxidize. If you're speedy, you can pull-off the second reflow cycle before the copper g
Electronics Forum | Tue Jun 05 21:14:10 EDT 2001 | davef
You aren't going to post our stuff on your "Hey, I'm the wizard site", are you? Board fab, Pad coatings, OSP 1 OSPs: Imidazole (Via Systems) is good. Entek (Enthone) works, but requires strict thickness control in fab. 2 Enthone CU56 allows one t
Electronics Forum | Tue Oct 17 12:15:19 EDT 2000 | NLykus
Dave, Current process is Insert through hole components topside Dispense SMT glue Place SMT components bottom side Glue cure Insert 1 through hole component by hand Wave Wave temperature is 480oF Topside preheats in D.O.E ranged from 99oc to 108oC
Electronics Forum | Mon Mar 17 11:56:38 EDT 2008 | dyoungquist
We have had VERY GOOD free tech support from Mydata. However, we bought a refurbished TP9 directly from them. I believe if you by a used MyData machine from someone else there is a fee to register your company and the machine in their system before
