Industry Directory | Manufacturer
Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.
Industry Directory | Manufacturer
We are automatic cutting machine, edge grinding machine, corner rounding machine, pinning machine, deburring machine manufacturer since 2011. We not only offer single machines, but also the full auto line of machines.
New Equipment | Assembly Services
PCB turn corner conveyor loader for 90 degree PCB turn corner conveyor loader for 90 degree Email:info@smtlinemachine.com Skype:smtdwx M/P/Whatsapp/wechat:+8615915451009 WWW.smtlinemachine.com
New Equipment | Assembly Services
90 180 Degree PCB flipper Machine 90 180 Degree PCB flipper Machine Email:info@smtlinemachine.com Skype:smtdwx M/P/Whatsapp/wechat:+8615915451009 WWW.smtlinemachine.com
Electronics Forum | Fri May 14 09:00:55 EDT 2004 | neil
Yes, the SMTneters corner is still available. We just didn't keep the navigation link to it. You can find it here: http://www.smtnet.com/smtneters/ Neil
Electronics Forum | Thu May 13 13:18:51 EDT 2004 | cyber_wolf
Is this feature still available on this website ? Is there still some way to look at an individuals postings ?
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment
Industry News | 2003-06-02 09:14:01.0
Specification-Driven Circuit Design Environment Now Slashes Validation Time Up to 10x
Industry News | 2023-08-17 14:26:37.0
Today, KINGSUN shares with you the common types and classifications of SMT mounters.
Parts & Supplies | Assembly Accessories
FUJI DEEM5391 XP243 series right angle DEEM5391 Corner
Parts & Supplies | Pick and Place/Feeders
About how to set up X1, Y1, X2, Y2 and X3, Y3 for JUKI 750 IC tray, and Z.Pls stand in front of the machine, then set them as below: Center point of the first IC component in lower left corner is X1,Y1 Center point of the first IC compone
Technical Library | 2014-01-02 15:56:55.0
With ROHS compliance the transition to lead-free is inevitable. Several lead-free alloys are available in the market and its reliability has been the main concern. The results from this experimental research aims at making a comparison of different lead-free alloy combinations. Thermal shock and drop tests are a part of this experimental study.
Technical Library | 2018-04-05 10:40:43.0
The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.
E1503716000 TRAY DOOR E1503719000 CORNER COVER BRACET E1503726000 SHUTTER SP E1503729000 COVER SBL (ML) E150375500B COVER joinT TL E1504716000 DOOR HANDLE E150475500B COVER joinT UL(Z) E1505716000 TOP COVER E1505717000 ST TRAY GUIDE
E1503716000 TRAY DOOR E1503719000 CORNER COVER BRACET E1503726000 SHUTTER SP E1503729000 COVER SBL (ML) E150375500B COVER joinT TL E1504716000 DOOR HANDLE E150475500B COVER joinT UL(Z) E1505716000 TOP COVER E1505717000 ST TRAY GUIDE
Events Calendar | Thu Apr 16 00:00:00 EDT 2020 - Thu Apr 16 00:00:00 EDT 2020 | Peachtree Corners, Georgia USA
SMTA Atlanta Expo & Tech Forum
Events Calendar | Thu Feb 01 00:00:00 EST 2024 - Thu Feb 01 00:00:00 EST 2024 | Houston, Texas USA
Houston Chapter Hybrid Event: Increasing your Trade Show ROI
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
