Electronics Forum | Mon Nov 08 12:12:21 EST 2004 | davef
Your customer's cost will increase. Consider: * The majority of no-lead components have matte tin solderability protection. Bright tin, as mentioned by an earlier poster, has had reliability issues. Many component suppliers have documented their re
Electronics Forum | Tue Mar 21 20:25:30 EST 2000 | Dave F
John: What�s the matter? Free gold � good thing for you, bad thing for your supplier. :^) Pre-tinning of gold plated leads is important to: � Prevent gold embrittlement of the solder joint � Determine if the leads are solderable prior to assembly (
Electronics Forum | Mon Dec 01 15:21:08 EST 2003 | davef
Hey, I thought you were in the BIG house on some trumped-up tax rap. We use many RF shields each month. Generally, the shields are not plated and made of alloy 770 (or alloy 752), half hard temper, as the base material. * Alloy 770; 55%Cu, 27%Zn,
Electronics Forum | Thu Oct 30 21:55:13 EDT 2014 | davef
Why soldering issues? I'd guess the nickel is corroded. It is very difficult to solder to oxidized nickel. Your SAC305 would get kicked all the way down the conveyor by nickel oxide. A lack of Ni-Sn-IMC formation will confirm this dewetting . What's
Electronics Forum | Thu Jun 17 07:04:03 EDT 2004 | davef
It sounds like the parts are not soldering properly [have poor solderability]. This probably due to corroded nickel underplate caused by: * Nickel that oxidized, while awaiting overplating * Poor quality tin overplate, allowing nickel to oxidize aft
Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal
Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process
Electronics Forum | Tue Dec 14 17:02:04 EST 1999 | John Thorup
Hello Kris If you do have and OSP coating I'd say Curtis has nailed it. But you seem to have references to gold. Does this board have a standard nickle/gold finish. If so what sort of "solder on gold" problems were you having? Reading between the
Electronics Forum | Thu Apr 24 20:39:01 EDT 2003 | davef
3NaH2PO3 + H2SO4 + 2H2 + Ni^0 Potassium is co-deposited with the nickel, as follows: H2PO2^- + Hads => H2O + OH^- + P 3H2PO2^- + P => H2PO3^- + H2O + 2OH^- Nick Biunno gives a very short, over simplified summary: "Everybody looks at the nickel, b
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