Electronics Forum: dave and f (Page 81 of 189)

Re: Decommissioning or Scrapping PTH/SMT equipment

Electronics Forum | Thu Mar 30 22:04:39 EST 2000 | Dave F

Armin: The stuff that Jax says is spot-on from a "bean counter" stand-point. Not that I'm say that Jax is one, he's aparently had training in dealing with them. But there's another apect that doesn't show on the spreadsheets and factor anaylsis. I

Re: Min Hole/Pad distance to edge of PCB

Electronics Forum | Tue Mar 14 21:22:41 EST 2000 | Dave F

Bingo!!! By panelizing and adding breakaway rails (as Nancy says), Stuart can pour copper up to his board fab's tolerance from the board edge. Traditionally, he just wants to make sure no copper shows on the edge of the board. Then again, it's his

Re: RE: Failure of Moisture Barrier Bags Shipped by Air

Electronics Forum | Thu Mar 09 22:03:04 EST 2000 | Charles Leech

DaveF: Since these SMT "spounges" get wet in Singapore and they got to get dry in Singapore, the airfreight idea won't work. I don't think the airlines would be too thrilled with a teathered ballon floating 10,000 feet in the air over the city. STAT

Re: Removing Component Part Number

Electronics Forum | Thu Mar 02 21:09:22 EST 2000 | Dave F

Doug: To remove paints, we've tried a bunch of stuff like messy, hazardous chemicals (ie, methylene chloride, xylene, toulene). We've blasted (erzat been blasted???), like Stu says. We used etching pens. Auuuurgh!!! Now, we paint over them with

Re: Reliability Problem

Electronics Forum | Wed Mar 01 17:09:51 EST 2000 | Dave F

Gwen: Failures occur during a products life cycle, as you say. According to Reliability Analysis Center, overall factors affecting reliability are: � Maintenance shop (17%) � Hardware reliability (16%) � Retest OK (28%) � Design (21%) � Quality (18

Re: Solderability on Immersion Gold

Electronics Forum | Wed Mar 01 17:05:34 EST 2000 | Dave F

Glenn: I hear you, but when Steve talks about a "dark haze" and "scrap(ing) the �black stuff� off the pads" to make them solderable, but I don�t think of "black pad." I think of "black pad" as a surface coating that typically can not be removed by

Re: Cleaning No-Clean Paste??

Electronics Forum | Wed Feb 23 21:35:01 EST 2000 | Dave F

Larry: You're correct to question this: * We don't like to run raw paste through our aqueous cleaner. It makes a blinking mess. Your entire machine is probably now coated with hazardous material ... well at least the first tank and the out-bound

Re: Tin/Silver solder paste fillets

Electronics Forum | Thu Feb 17 21:42:12 EST 2000 | Dave F

Hey Bud: Moved from that Bi-crap to something serious, eh? Several things: 1 Get in touch with Doug Romm (drom@msg.ti.com) at Texas Instruments. He talks palladium. 2 Review the archives on Palladium. 3 I think you're running light on temps. Eut

Re: BGA PAd Soldermask

Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak

Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Thu Feb 22 12:26:33 EST 2001 | traviss

I used a Blue M batch oven quite a bit to cure in works great. All you have to do is get the board up to cure temperature, 150C normally and your all set. It will probably be in there longer than the time required but at that low temperature it shoul


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