Electronics Forum | Tue Jun 06 13:19:31 EDT 2000 | ZAKIR AHMAD
Our company do electronic packaging for space applications. One of the problems we face during our design is whether or not to stake/bond the surface mount components to the board to survive the vibration qualification environment. If we do staking
Electronics Forum | Tue May 22 18:21:15 EDT 2001 | davef
Again not quite what your looking for, but close, consider IPC-2221, Generic Standard On Printed Board Design, Para. 4.4.4 for minimum requirements for edge board connectors, as a baseline.
Electronics Forum | Thu May 24 17:42:44 EDT 2001 | davef
Darn good point!!! * Accu-System [ 3100 VSC] 215-830-9826 * Radoll Design Score Depth Indicator http://www.radoll.com
Electronics Forum | Mon Jun 11 21:27:43 EDT 2001 | procon
Way to go CPI! This is a classic example of design. Many people experience this when the have an 0402 close to a QFP or other large components. The pad closest to the larger component will become liquidous later than the pad farthest. Hence, a new t
Electronics Forum | Thu Jun 14 16:33:32 EDT 2001 | pr
I have found all the advantages (that others have spoken about) are true. One thing to look at is the quick disconnect system that MPM offers which will reduce changeover times to almost the same as blades. It's well designed and so far, for us, has
Electronics Forum | Wed Jun 13 21:31:27 EDT 2001 | davef
Lotsa ways to bust caps. First: placement force; Second: thermal stress; Third: poor pad design. Forth: then, ummm maybe the cap supplier. Please describe the crack in more detail. Where does the crack start? Where does the crack go?
Electronics Forum | Thu Jul 12 21:21:24 EDT 2001 | mugen
Hear! Hear! Hark do we hear the ringing bell of the town crier? DFM = design for manufacturability covers PDCA cycle for prototype and practically anything that needs engineering (common sense inclined) review, under the glorious sunny radiant heat
Electronics Forum | Fri Jul 13 14:56:01 EDT 2001 | stevenamacdonald
One of our board vendors recently switched their stencil design to home plate apertures. Since the change the quality and yield of their PCB's has went south, Could this process change be the cause?
Electronics Forum | Sat Jul 21 03:46:25 EDT 2001 | Lex WW
Dave, thank you for the pointer. The Amkor site covered most of the basics, from the package design to assembly guidelines. If you have any further tips on assembling this package, I'd much appreciate it. Thanks again..
Electronics Forum | Mon Jul 23 20:23:19 EDT 2001 | davef
Flux charring * Cool-down too long => Coarse grain ps: Some would argue that potentially you'd get greater response in the process forum rather than the design forum
