Electronics Forum: did (Page 121 of 411)

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 16:02:37 EST 2001 | dblsixes

In the end, we may have to go to our customer to see if we can get Class 3 relief ... We actually did an experiment by adding a ceramic cap to the top of the part, using a thermal paste to improve the thermal connection. It didn't do much for us ..

Photos

Electronics Forum | Thu Apr 26 11:00:42 EDT 2001 | bdoyle

I have seen a few threads where people link to outside pictures. here's one: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=6095 Sites like http://www.50megs.com are great for storing images. You can do exactly what Dave did and link to

Re: PIHR

Electronics Forum | Thu Jul 20 14:31:20 EDT 2000 | Bob Willis

The process is not that difficult so have a go as soon as possible. Take a board wipe some paste on a board stick the part in and run it through the reflow process. Don�t worry about balling just see what you get first, that what I did first ! The m

Loctite Adhesive Viscosity

Electronics Forum | Tue May 15 08:40:52 EDT 2001 | Stefan Witte

The viscosity is only consistent over a small temperature range. If your room temperature has changed by a few degrees, it can make all the difference. You may have to increase the settling time. We did not check the viscosity, but measured the con

solder balls

Electronics Forum | Mon Jul 16 09:04:00 EDT 2001 | Hussman

No argument here. But I've don't think I've ever seen solder balls on 0402s. Even when they're placed on narrow G dimension pads, where there is little toe fillet, I've never seen a solder ball. But your idea of reversed homeplates would work grea

Recommendations for ultrasonic cleaning solution

Electronics Forum | Tue Jul 24 08:09:24 EDT 2001 | tommiller

I�m using Zestron's Vigon sc 200 in our ultrasonic cleaner. It works great for cleaning our adhevises and pastes (RMA and no clean) from stencils and misprinted PCBs. We used to use a saponifier which did a terrible cleaning job and was a real pain t

Assembly Technology Expo 2000

Electronics Forum | Tue Jul 17 22:32:30 EDT 2001 | CAL

One Inspection Unit was from Original Solutions. It was mid way through the line near the Fuji machine. If this is the system contact Mike Feld at OriginalSolutions.com The give away did no require sophistication and dont think there was two AOI unit

Question on BGA Solderability

Electronics Forum | Tue Jul 24 13:26:10 EDT 2001 | gdstanton

Steve, I was aware of the rework requirement but was looking more towards the reflow profile. I wanted to know if there was any significant benefit other than rework itself. I suspected there isn't but I just wanted to be sure. Bye the way--did y

Question on BGA Solderability

Electronics Forum | Tue Jul 24 14:00:08 EDT 2001 | Steve Schrader

Greg, Yes, I did my tour of duty. Is your boss back from Bermuda yet? If so, tell her to check her email! Thanks. BTW, there could be a benefit to moving parts, but that would be dictated by your ability/inability to achieve a proper reflow prof

Printing problem, water soluble paste with gold plating PCB..

Electronics Forum | Mon Jul 30 18:52:43 EDT 2001 | Brian W.

You did not provide the stencil thickness or your aspect ratio. If your aspect ratio (Aperture width/stencil thickness) is less than 1.5, the paste will not release correctly from the aperture, leaving paste in the aperture. For example, if your pa


did searches for Companies, Equipment, Machines, Suppliers & Information