Electronics Forum: done (Page 36 of 294)

Next Philips question........

Electronics Forum | Tue Aug 21 12:57:52 EDT 2007 | vervin

There is a way to copy the setup file as well. I've done and used them to create work instructions for the operators, but since I don't have the machine right in front of me, I don't remember exactly what file to export.

PCB pad contamination

Electronics Forum | Sun Aug 26 11:27:12 EDT 2007 | vangogh

Hi Davef, Thanks for the reply. There seem to be no issues on SMT reflow based on some samples done. We have not stripped the gold yet. We did a X-section+EDX and we are seeing traces of copper on the nickel layer. Any idea what is the implication of

MPM AP25 Squeege Pressure not Set

Electronics Forum | Fri Sep 21 17:35:46 EDT 2007 | valuems

the answer is very simple, it comes from 12 years of experience on the mpm's. And once you've done a calibration on the programmable print head, on a AP model you will know what I mean when I say it is not the easiest thing to do. harry

MPM AP25 Squeege Pressure not Set

Electronics Forum | Fri Sep 21 17:46:07 EDT 2007 | chrisgriffin

Right you are. Count on it taking at least an hour if you've never done it before. I think they made the pro-head way too complicated. Standard UP style heads are so much easier.

Need Contract Rework for Computer Memory

Electronics Forum | Tue Oct 02 16:00:03 EDT 2007 | stimpk

Do you still this done? What type of rework is required? Please provide a little more info.. ksimpson@spectralresponse.com

Intermettalic layer analyssis

Electronics Forum | Fri Sep 28 07:42:07 EDT 2007 | zanolli

We have the need to verify that proper intermetallic layer between a 100% Sn plated contact and the solder joint is being formed. Never having done this before: Is there any specifications, etc. that we can use as acceptability criteria?

BGA reflow on bottomside

Electronics Forum | Tue Nov 20 04:48:21 EST 2007 | beta

Hi all, I have never had to run a product with BGAs on the bottomside of a double sided board. I was just wondering if this is a done thing ? or should I stay well clear. any replies appreciated. aj...

BGA reflow on bottomside

Electronics Forum | Tue Nov 20 12:25:52 EST 2007 | realchunks

It can be done. But as Rob states, use edge rail oven. We have a product 18 inches long by 9 inches wide with BGAs on both sides.

Fiducial replacements?

Electronics Forum | Mon Dec 03 11:44:14 EST 2007 | stepheniii

I've done a couple fiducial transplants from populated boards to non-populated boards in the past. I've also used a soldering iron on irregular shaped HASL fids to round them out. And that is a vintage rant.

Amkor Fusion Quad

Electronics Forum | Thu Jan 31 20:51:10 EST 2008 | stevek

Wow, they claim 1000 cycles of -65 to 150. I wonder if this was done with the 24mm part. With those tiny joints underneath, they must have exactly matched CTE's with their test boards.


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