Electronics Forum | Fri Jun 06 07:37:38 EDT 2003 | mattiasw
Hi! I just wanted to shortly share my experience with AOI machines. We have a VisionPoint from Diagnosys (Same software as in the Photon dynamics machines) and the machine is doing it�s job really good actually...BUT! The machine building quality is
Electronics Forum | Thu Jul 13 04:01:02 EDT 2000 | JohnW
Dave, Firstly..how the heck are you?..been a while.... Ok so I'm running an Electrovert Electra witha hot gas knife, & I've got large server boards going over the wave. I've seen us loose chip, mainly Tants on the hot gas knife...ain't good especia
Electronics Forum | Tue Jul 11 15:59:52 EDT 2000 | JohnW
George, I looked at the winkic & profit software and tool's a while ago along with some of the alternatives. No matter what anyone tell's you in the 1st instance you do still need a profile card as what you are doing is comparing the known good prof
Electronics Forum | Thu Jul 06 20:46:17 EDT 2000 | Dave F
Mark: An area of increasing interest to all of us. From the SMTnet "Terms & Definitions" (or whatever they call it) Globtop. Encapsulant. Encapsulating. Encapsulation. Potting. Enclosing an article in an envelope of adhesive or encapsulating co
Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F
Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan
Electronics Forum | Thu Jun 22 11:42:29 EDT 2000 | Chrys Shea
Sal, Silly question: Were the parts skewed before they went into the oven? I've chased down a few similar reflow problems in my lifetime, only to find out it was a pick and place problem. Wrong nozzle size, bad nozzle, feeder not advancing all
Electronics Forum | Thu Jun 22 11:01:54 EDT 2000 | Chrys Shea
Jason, Double sided reflow should be no problem. People have been doing it for years. The surface tension of the molten solder will hold the components on the bottom side during your second pass. This is almost always the case, unless you have re
Electronics Forum | Thu Jun 22 11:02:13 EDT 2000 | Chrys Shea
Jason, Double sided reflow should be no problem. People have been doing it for years. The surface tension of the molten solder will hold the components on the bottom side during your second pass. This is almost always the case, unless you have re
Electronics Forum | Thu Jun 22 12:25:07 EDT 2000 | Boca
Jason, What Chrys said! Don't try to run the bottom cooler, tried it in the mid 80's, don't work and don't want it to work. If one side of a fab is maintained cooler than liquidus and the other side into reflow it would have an easy 40C temp diffe
Electronics Forum | Thu Jun 15 21:51:17 EDT 2000 | Dave F
Jeff: You're correct �7.1.3 of ANSI J-STD-001C states " Drying / Degreasing states the assembly may be treated to remove moisture and other volitiles." We don't bake "FR4" for love nor money. The archive are littered with threads along this line.
