Electronics Forum: electronic (Page 2338 of 7894)

Solder paste volume require.

Electronics Forum | Tue Jun 06 17:00:36 EDT 2006 | pjc

Be carefull of the effect on other components with a 7mil stencil, like fine-pitch devices will bridge more, excess solder.

Solder paste volume require.

Electronics Forum | Wed Jun 07 09:26:09 EDT 2006 | amol_kane

can you also please tell us the section in IPC-610?...is this in RevD? also, does this also give the solder volume for BGAs? Thanks, Amol

Thermal Profiler Shield

Electronics Forum | Thu Jun 01 10:05:20 EDT 2006 | geb

Ok, thank you. I want to reduce the maximum temperature that the profiler reaches. I reckon that I need to get a shielding box for it. Can anyone recommend a shield that is cheaper from a UK supplier. �525 from KIC's distributor is too expensive.

Thermal Profiler Shield

Electronics Forum | Thu Jun 01 14:26:24 EDT 2006 | ratsalad

Send an email to cuculi54986@yahoo.com and I'll respond with a picture. If anyone else wants one, please let me know

SUZUKI Pick and Place Machine

Electronics Forum | Sat Jun 03 13:45:17 EDT 2006 | resource

Hello, We are SUZUKI SMT machines distributor in India & we have trained manpower. You may pl. contact our service manger off-line at his email ID : smtsupport@smt-india.com and he will try to help you on this

SUZUKI Pick and Place Machine

Electronics Forum | Tue Jun 13 12:25:46 EDT 2006 | nodlac

I asume you are in the US. I would send an email directly to suzuki's technical support team. tech@suzukinet.co.jp Enjoy, Cal Driscoll

minimum solder ball (bead) size

Electronics Forum | Wed Jun 07 21:45:53 EDT 2006 | davef

We do not understand the question. Take a deep breath, remember not all of us are trained as geologists. The smallest solder ball we've seen is a little less than 5 nm.

minimum solder ball (bead) size

Electronics Forum | Thu Jun 08 09:54:07 EDT 2006 | slthomas

Awwww, man. I was looking for something a little less on the anecdotal side for our local municipality's environmental stewards.

BGA Underfill Rework

Electronics Forum | Wed Jun 07 07:53:24 EDT 2006 | RLM

This is true but even the so called reworkable underfill takes a lot of effort. We use a loctite reworkable that requires heat to soften the underfill. Once the component is removed we use acetone and a swab to scrub the pcb clean. This can be very t

BGA Underfill Rework

Electronics Forum | Fri Jun 09 01:27:07 EDT 2006 | Scott

Thanks for the info. I've been able to arrange some training with the local branch of Samsung, who are getting engineers from Korea to come over to teach us. It sounds like an exercise in wasted time and manpower to me, but that's what you get I supp


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