Electronics Forum | Sun Oct 09 01:11:34 EDT 2005 | vev
There is a stencil cutting machine in the industry which utilizes a water jet to deliver a Laser beam for cutting stencils. There are no machines of this type in the states. The quality is no better than a Laser cut stencil using a good Laser System.
Electronics Forum | Wed Oct 05 11:45:30 EDT 2005 | chunks
Not knowing your company, I would treat LF boards as a new part number. All boards are sold in lots, so controlling both part numbers at the same time would be easy. May add to your inventory but beats mixing.
Electronics Forum | Wed Oct 05 11:49:22 EDT 2005 | russ
We have the pb free symbology embedded in copper on the fabs.
Electronics Forum | Fri Oct 07 04:15:09 EDT 2005 | GS
do not forget,ROHS Directive does not allow other chemical substances (ie. PBB, PBDE,....) that could be in PCBs, so the PCB must be ROHS compliant and not only Pb Free. That means be carefully when marking PCB or PBAs. Regards..........GS
Electronics Forum | Tue Oct 04 11:42:07 EDT 2005 | Bob Leible
I was wondering if anyone has studied the effects of tin lead solder in the wave. If we leave the same solder in the solder pot, how many COMPLETE cool downs and start ups can the solder go through before it begins to break down? Please let me know
Electronics Forum | Tue Oct 04 12:49:59 EDT 2005 | patrickbruneel
The amount of times the tin/lead solder can be melted and solidified is unlimited and the heat cycles do not affect the solder characteristics. The only reason for changing the solder pot is when impurities are at or over the maximum levels.
Electronics Forum | Tue Oct 04 11:46:02 EDT 2005 | johnw
Hi guys I am looking for rubber mats to place over the carriers before entering the wash plant so the boards dont fall out of the carrier any ideas whereI can get my hands on these I am in the uk cheers
Electronics Forum | Tue Oct 04 13:44:41 EDT 2005 | ???
Do any of you guys/gals that use these machine's have problems with the machine consistently finding no solders on 0402 parts???
Electronics Forum | Wed Oct 05 15:31:44 EDT 2005 | chunks
Thanks Amol, You brought up some good ideas that we'll use. Has anyone ever heard of under filling the BGA (after reflow) with a material that cures, then thermal removing the BGA to check the acual size of the ball to pad?
Electronics Forum | Thu Oct 06 07:28:11 EDT 2005 | chunks
The obvious is size. Besides that, it depends on your screen printer. Some "smart heads" need to be retaught with the metal blades for each board. Some need to have the set-up programmed changed too. Angle of attack is something to double check a
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