Electronics Forum: fabrication process (Page 21 of 38)

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Sat Dec 02 10:23:47 EST 2017 | tomh

Have you ever heard of "Solder Mask Defined Thermal Pads"? I wrote a short blurb on this here - https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html This technology saves fabrication costs by not havi

SMT Stencil Design

Electronics Forum | Fri Feb 16 03:11:35 EST 2018 | robl

Hi Ameen, Have you tried talking to your local stencil fabricator? they tend to have rule sets built up over years of experience. We are very lucky in the UK to have excellent, very knowledgeable suppliers. Also, stencil design rules are built in

Has anyone heard of a no clean paste that can be cleaned in straight DI water ?

Electronics Forum | Tue Jan 30 18:25:25 EST 2018 | aqueous

This is one of the most common questions I get asked. Why clean no-clean flux. It was stated earlier that no-clean residues are benign. This may or may not be accurate. It depends on several factors including the reflow process. In a perfect world, t

MELF component/solder failure

Electronics Forum | Thu May 08 10:16:17 EDT 2003 | davef

Observations are: * Center most lead of the fuse on the top right of the assembly looks like it has excellent solder flow, but this is PTH. From the amount of solder, it must have been wave or hand soldered. * Center most lead of the fuse on the bot

Re: More moisture-sensitivity ??'s

Electronics Forum | Mon Apr 24 17:42:34 EDT 2000 | Dave F

Rich: Awww, don�t worry that you have to ship product. This moisture sensitive part thing is more important. ;-) And don�t worry that everyone is giving you guff and no one is supporting you. Yours is a thankless job. ;-) You got it right!!!

Re: Ionic testing and No-Clean flux

Electronics Forum | Sat Feb 05 09:08:18 EST 2000 | Dave F

Casimir: Let me expand on something that I said in my response to your thread on ionic testing. Generally, no-clean people don�t use ROSE testing as part of their process control, because the ROSE test is essentially washing your board in DI/IPA �

Re: Plating Processes

Electronics Forum | Fri Oct 30 01:07:34 EST 1998 | Earl Moon

| I am a recently graduated Process Engineer. I am working for a company developing and manufacturing printed circuit boards. I am looking for a web link, magazine article, book, etc which describes the processes which happen at a board house. More s

Substrate Au/Ni thickness

Electronics Forum | Tue Feb 20 16:31:49 EST 2001 | davef

Let�s be basic. The two most common causes of BGA opens that we talk about here are: 1 Gold thickness and 2 Black pad. Given the thickness of gold that you talking about, it�s reasonable to consider thickness as the first alternative to investigat

Immersion Silver - Sulphur

Electronics Forum | Sun Feb 23 14:32:42 EST 2003 | davef

Sources of sulphur in PCB fabrication are: * Some locales have high H2S concentrations in the air. * Metal etching steps that use sulfuric acid or a sulfonated buffering compound may result in sulfate residues. * Sulfates can come from contact with

Moisture absorbtion in circuit boards

Electronics Forum | Thu May 09 17:28:33 EDT 2002 | davef

There is no IPC specification, nor should there be. * There are just too many peculiarities in the design and fabrication of PWB. * The issue is not defining how to store boards. The issue setting expectation for reliable products and allowing you th


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